TPS2300, TPS2301 Dual Hot Swap Controller Evaluation Module and Interface Card User’s Guide April 2000 Mixed Signal Products SLVU026
IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete.
Contents Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 TPS2300 and TPS2301 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 EVM and Interface Card Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Layouts of the EVM and the Interface Card . . . . . . . . . . . . . . . . . . . . .
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Chapter 1 Introduction The TPS2300 and TPS2301 are new Texas Instruments hot-swap controllers that eliminate high-frequency hot-plug or hot-removal transients, reduce inrush current, and provide overcurrent protection. The evaluation module (EVM) and interface card can help designers evaluate the devices and simulate hot-insertion and hot-removal actions under various conditions. Users will need at least one dc voltage supply to test the operation of the EVM. Topic Page 1.1 TPS2300 and TPS2301 . . . .
TPS2300 and TPS2301 1.1 TPS2300 and TPS2301 Both the TPS2300 and TPS2301 are dual-channel hot-swap controllers that use external N-channel MOSFETs as high-side switches in power applications. The devices integrate features such as overcurrent protection, inrushcurrent control, output-power status reporting, and separation of load transients from actual load increases, which are the critical requirements for hotswap applications.
EVM and Interface Card Schematics Figure 1–1. Hot-Swap Evaluation Module (EVM) Schematic Q1 SI4410DY IN1 J1 OUT1 J2 IN1 OUT1 R1 0.01 Ω C3 1 µF 0.1 µF C6 0.1 µF GND R6 NU FAULT R9 49.9 kΩ 7 6 13 20 17 PG1 VSENSE1 VSENSE2 U1 TPS2301IPW 6800 pF C10 C9 NU NU R11 0.1 µF C11 GND 10 µF C14 GND IN2 1 µF C15 0.1 µF C16 R12 49.
EVM and Interface Card Schematics The figures show that the hot-swap EVM board has two supply inputs: IN1 and IN2; but the interface board has three supplies available. VIN3 on the interface board is not used for the evaluation of the dual hot-swap EVM board. Additionally, a key is installed in the edge connector on the interface board to prevent plugging the hot-swap board in the wrong direction. The bills of materials (BOM) for the boards are shown in Tables 1–1 and 1–22. Table 1–1.
Layouts of the EVM and the Interface Card Table 1–2. Components on the Interface Card (SLVP155) Reference Qty. Part Number Description MFR.
Setup of the EVM Figure 1–4. Top Layer of the Interface Card, and Placement of Components Top Layer Top Assembly 1.4 Setup of the EVM For proper operation of the EVM, follow these steps for dual hot-swap evaluation: 1) Verify that the power-supply voltages are in the required ranges: 3 V < Supply #1 < 13 V; 3 V < Supply #2 < 5.5 V. Make sure the supplies have the capability to supply the current that the loads need. Turn off the supplies.
Changeable Components and Test Points on the Hot-Swap EVM Users can increase the current limit by increasing the resistance of the setting resistor R4 or R13, or by reducing the sense resistance of R1 or R17 for the respective channel. However, the maximum current should not exceed the current capability of the external MOSFET and the connectors on the board. 4) Set switch S1 on the interface board to HI to hot-plug the hot-swap board into the power supplies.
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