Datasheet

TPS22980
www.ti.com SLVSB61C –DECEMBER 2011–REVISED SEPTEMBER 2013
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1) (2)
VALUE UNIT
Input voltage range on V3P3 (VDD)
(3)
–0.3 to 3.6
Input voltage range on EN, HVEN, ISET_V3P3, ISET_S0, ISET_S3, S0
(3)
–0.3 to V3P3+0.3
V
I
Input voltage range on VHV
(3)
–0.3 to 20 V
Output voltage range at OUT
(3)
–0.3 to 20
Output voltage range at V3P3OUT
(3)
–0.3 to V3P3+0.3
T
A
Operating ambient temperature range –40 to 85 °C
T
J (MAX)
Maximum operating junction temperature 110 °C
T
stg
Storage temperature range –65 to 150 °C
Charge Device Model (JESD 22 C101) 500 V
ESD Rating
Human Body Model (JESD 22 A114) 2 kV
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be de-rated. Maximum ambient temperature [T
A(max)
] is dependent on the maximum operating junction temperature [T
J(max)
], the
maximum power dissipation of the device in the application [P
D(max)
], and the junction-to-ambient thermal resistance of the part/package
in the application (θ
JA
), as given by the following equation: T
A(max)
= T
J(max)
– (θ
JA
× P
D(max)
)
(3) All voltage values are with respect to network ground terminal.
THERMAL INFORMATION
TPS22980
THERMAL METRIC
(1)
RGP UNITS
16 PINS
θ
JA
Junction-to-ambient thermal resistance 38.9
θ
JCtop
Junction-to-case (top) thermal resistance 30.7
θ
JB
Junction-to-board thermal resistance 11.5
°C/W
ψ
JT
Junction-to-top characterization parameter 0.4
ψ
JB
Junction-to-board characterization parameter 11.4
θ
JCbot
Junction-to-case (bottom) thermal resistance 2.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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