Datasheet
TPS22965
SLVSBJ0A –AUGUST 2012–REVISED AUGUST 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)(2)
VALUE UNIT
(2)
V
IN
Input voltage range –0.3 to 6 V
V
OUT
Output voltage range –0.3 to 6 V
V
BIAS
Bias voltage range –0.3 to 6 V
V
ON
Input voltage range –0.3 to 6 V
I
MAX
Maximum continuous switch current 6 A
I
PLS
Maximum pulsed switch current, pulse <300 µs, 2% duty cycle 8 A
T
A
Operating free-air temperature range
(3)
–40 to 85 °C
T
J
Maximum junction temperature 125 °C
T
STG
Storage temperature range –65 to 150 °C
T
LEAD
Maximum lead temperature (10-s soldering time) 300 °C
Human-Body Model (HBM) 2000
Electrostatic discharge
ESD V
protection
Charged-Device Model (CDM) 1000
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature [T
A(max)
] is dependent on the maximum operating junction temperature [T
J(max)
], the
maximum power dissipation of the device in the application [P
D(max)
], and the junction-to-ambient thermal resistance of the part/package
in the application (θ
JA
), as given by the following equation: TA
(max)
= T
J(max)
– (θ
JA
× P
D(max)
)
THERMAL INFORMATION
TPS22965
THERMAL METRIC
(1)
UNITS
DSG (8 PINS)
θ
JA
Junction-to-ambient thermal resistance 65.3
θ
JCtop
Junction-to-case (top) thermal resistance 74.2
θ
JB
Junction-to-board thermal resistance 35.4
°C/W
ψ
JT
Junction-to-top characterization parameter 2.2
ψ
JB
Junction-to-board characterization parameter 36.0
θ
JCbot
Junction-to-case (bottom) thermal resistance 12.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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