Datasheet

Bump View
1
2
B
C
A
Laser Marking View
2
1
B
C
A
TPS22946
SLVS984A –SEPTEMBER 2009–REVISED FEBRUARY 2010 www.ti.com
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
–40°C to 85°C WCSP – YZP (0.5-mm pitch) Reel of 3000 TPS22946YZPR _ _ 5 H _
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) The actual top-side marking has two preceding characters to denote year, month and one following character to designate the wafer
fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
YZP PACKAGE
TERMINALS ASSIGNMENTS
C ON OC
B CL GND
A V
IN
V
OUT
2 1
TERMINAL FUNCTIONS
TERMINAL
TYPE DESCRIPTION
NO. NAME
A1 V
OUT
O Output of the power switch
B1 GND – Ground
Over-current output flag. Active-low open-drain output that indicates an over-current, supply
C1 OC O
under-voltage, or over-temperature state.
C2 ON I On/off control input
Current limit selection. CL high is 155-mA current limit, CL low is 70-mA current limit, and CL floating is
B2 CL I
30-mA current limit.
A2 V
IN
I Supply. Input to the power switch and the supply voltage for the device
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Product Folder Link(s): TPS22946