Datasheet

www.ti.com

Board Layout, Schematic, and Bill of Materials

Table 2. Bill of Materials

Count RefDes Value Description Size Part Number MFR

1 – PCB, 0.9 In x 1.7 In x 0.062 In HPA661 Any

1 C3 0.1 µF Capacitor, Ceramic, 16-V, X7R, 10% 603 Std Std

1 µF or 10µF for A

1 C2 Capacitor, Ceramic, 25-V, X5R, 10% 603 Std Std

type

0 C1, C4 OPEN Capacitor, Ceramic 603 Std Std

1 R1 560 Ω Resistor, 5% 1/8W 805 Std Std

1 R2 14 Ω Resistor, 1% 1/8W 805 Std Std

0 R3 OPEN Resistor, 5% 1/8W 805 Std Std

J1–J6, JP1–2,

13 PEC02SAAN Header,2pin, 100mil spacing 0.100 inch x 2 PEC02SAAN Sullins

JP4–8

1 JP3 PEC03SAAN Header,3pin, 100mil spacing IC, 0.100 inch x 3 PEC03SAAN Sullins

Single Chip, Low Input Voltage Current-Limited Load

1 U1 TPS2292xxDBV SOT25-6 TPS2292xxDBV TI

Switch with Shut Off Auto-Restart

3 N/A N/A Shunt, 100-mil, Black 0.100 929950-00 3M

Notes: 1. These assemblies are ESD sensitive, ESD precautions shall be observed.

2. These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable

3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.

4. Ref designators marked with an asterisk (**) cannot be substituted. All other components can be substituted with equivalent components.

Table 3.

Assembly Number Text

HPA661-001 TPS22928AEVM-661

HPA661-002 TPS22928BEVM-661

HPA661-003 TPS22928CEVM-661

HPA661-004 TPS22928DEVM-661

HPA661-005 TPS22929AEVM-661

HPA661-006 TPS22929BEVM-661

HPA661-007 TPS22929CEVM-661

HPA661-008 TPS22929DEVM-661

5.4 VOUT Rise Time Example TPS22929D

Figure 5. TPS229129D Trise Example

SLVU537– September 2011 TPS2292xEVM-661

Submit Documentation Feedback