Datasheet

D D
C C
B
B
A
A
2 1 1 2
LAZER MARKING
VIEW
BUMP VIEW
YZP PACKAGE
TPS22920
SLVSAY8A –JUNE 2011–REVISED JULY 2013 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Figure 2. Bump Assignments
Bump Assignments (YZP Package)
D GND ON
C V
OUT
V
IN
B V
OUT
V
IN
A V
OUT
V
IN
1 2
Pin Description
TPS22920
PIN NAME DESCRIPTION
YZP
D1 GND Ground
D2 ON Switch control input, active high. Do not leave floating
A1, B1, C1 VOUT Switch output
A2, B2, C2 VIN Switch input, bypass this input with a ceramic capacitor to ground
2 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated
Product Folder Links: TPS22920