Datasheet

TPS22910A , TPS22912C , TPS22913B , TPS22913C
SLVSB49D –NOVEMBER 2011 –REVISED MAY 2014 www.ti.com
8 Specifications
8.1 Absolute Maximum Ratings
MIN MAX UNIT
V
IN
Input voltage range –0.3 6 V
V
OUT
Output voltage range –0.3 6 V
V
ON
Input voltage range –0.3 6 V
I
MAX
Maximum continuous switch current 2 2 A
I
PLS
Maximum pulsed switch current, pulse < 300 µs, 2% duty cycle 2.5 2.5 A
T
A
Operating free-air temperature range –40 85 °C
T
J
Maximum junction temperature 125 125 °C
8.2 Handling Ratings
MIN MAX UNIT
T
stg
Storage temperature range –65 150 °C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
–2 2
pins
(1)
V
(ESD)
Electrostatic discharge kV
Charged device model (CDM), per JEDEC specification
–1 1
JESD22-C101, all pins
(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as 2 kV
may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Pins listed as 1kV
may actually have higher performance.
8.3 Recommended Operating Conditions
MIN MAX UNIT
V
IN
Input voltage range 1.4 5.5 V
V
ON
ON voltage range 0 5.5 V
V
OUT
Output voltage range V
IN
V
IH
High-level input voltage, ON VIN = 1.4 V to 5.5 V 1.1 5.5 V
VIN = 3.61 V to 5.5 V 0.6 V
V
IL
Low-level input voltage, ON
VIN = 1.4 V to 3.6 V 0.4 V
C
IN
Input capacitor 1
(1)
µF
(1) Refer to the application section.
8.4 Thermal Information
TPS22910 TPS22912 TPS22913
THERMAL METRIC
(1)
CSP CSP CSP UNIT
4 PINS 4 PINS 4 PINS
R
θJA
Junction-to-ambient thermal resistance 189.1 189.1 189.1
R
θJCtop
Junction-to-case (top) thermal resistance 1.9 1.9 1.9
R
θJB
Junction-to-board thermal resistance 36.8 36.8 36.8
°C/W
ψ
JT
Junction-to-top characterization parameter 11.3 11.3 11.3
ψ
JB
Junction-to-board characterization parameter 36.8 36.8 36.8
R
θJCbot
Junction-to-case (bottom) thermal resistance – – –
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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