Datasheet
TPS22908
SLVSBI7B –JULY 2012–REVISED MAY 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
Over operating free-air temperature range (unless otherwise noted)
(1)
VALUE UNIT
(2)
V
IN
Supply voltage range –0.3 to 4 V
V
OUT
Output voltage range –0.3 to (V
IN
+ 0.3) V
V
ON
Input voltage range –0.3 to 4 V
Maximum Continuous Switch Current for V
IN
>= 1.2V 1
I
MAX
A
Maximum Continuous Switch Current at V
IN
= 1.0V 0.6
T
A
Operating free-air temperature range
(3)
–40 to 85 °C
T
J
Maximum junction temperature 125 °C
T
STG
Storage temperature range –65 to 150 °C
T
LEAD
Maximum lead temperature (10-s soldering time) 300 °C
Human-Body Model (HBM) 2000
Electrostatic discharge
ESD V
protection
Charged-Device Model (CDM) 1000
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [T
J(max)
],
the maximum power dissipation of the device in the application [P
D(max)
], and the junction-to-ambient thermal resistance of the
part/package in the application (θ
JA
), as given by the following equation: T
A(max)
= T
J(max)
– (θ
JA
× P
D(max)
)
THERMAL INFORMATION
TPS22908
THERMAL METRIC
(1)(2)
UNITS
YZT (4 PINS)
Θ
JA
Junction-to-ambient thermal resistance 188
Θ
JC(top)
Junction-to-case(top) thermal resistance 2
Θ
JB
Junction-to-board thermal resistance 33
°C/W
Ψ
JT
Junction-to-top characterization parameter 9.1
Ψ
JB
Junction-to-board characterization parameter 33
Θ
JC(bottom)
Junction-to-case(bottom) thermal resistance N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953
(2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.
RECOMMENDED OPERATING CONDITIONS
MIN MAX UNIT
V
IN
Input voltage range 1.0 3.6 V
V
ON
ON voltage range 0 3.6 V
V
OUT
Output voltage range 0 V
IN
V
V
IH
High-level input voltage, ON 0.85 3.6 V
V
IL
Low-level input voltage, ON 0 0.4 V
C
IN
Input capacitor 1
(1)
µF
(1) Refer to application section.
2 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links :TPS22908