Datasheet

ON
V
OUT
GND
Turn-On Slew Rate
Controlled Driver
ESD Protection
V
IN
Control
Logic
A1
B1
A2
B2
Output Discharge
TPS22904 Only
TPS22903
TPS22904
SLVS827C –FEBRUARY 2009–REVISED APRIL 2010 www.ti.com
ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
TPS22903YFPR _ _ _4P_
–40°C to 85°C WCSP – YFP (0.4-mm pitch) Tape and reel
TPS22904YFPR _ _ _4R_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to
designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
BLOCK DIAGRAM
Figure 1. Functional Block Diagram
FUNCTION TABLE
ON
V
IN
TO V
OUT
V
OUT
TO GND (TPS22904 ONLY)
(CONTROL INPUT)
L OFF ON
H ON OFF
TERMINAL FUNCTIONS
TERMINAL
I/O DESCRIPTION
BALL NO. NAME
A1 V
IN
I Input of the switch, bypass this input with a ceramic capacitor to ground
A2 V
OUT
O Output of the switch
B1 ON I Switch control input, active high, do not leave floating
B2 GND – Ground
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Product Folder Link(s): TPS22903 TPS22904