User guide

Bill of Materials
4-2
4.1 Bill of Materials
COUNT RefDes Description Value Size Part Number MFR
3 C1, C2, C3 Capacitor, ceramic, 4.7−µF,
10−V, X7R, 10%
4.7 µF 1206 STD Taiyo
Yuden
6 C4, C5, C6, C7,
C9, C11
Capacitor, ceramic, 0.1−µF,
16−V, X7R, 10%
0.1 µF 805 STD Vishay
3 C8, C10, C12 Capacitor, Poscap, 68 µF, 16V,
20%
68 µF 7343(D) 10TPC68M Poscap
4 D1, D2, D3, D4 Diode, LED, Red SMD LN1271R Panasonic
1 J1 Header, 10−pin, 200 mil
spacing
TH HPM−10−05−T−S Samtec
1 J2 Connector SMD PX10BSB02 JAE
1 J2 Frame TH PX10FS02PH JAE
1 J3 Header, 6−pin, 200 mil spacing TH HPM−06−05−T−S Samtec
1 Q1 MOSFET, N−ch, 60−V,
115−mA, 1.2−Ω
SOT23 2N7002 Vishay−
Liteon
1 Q2 Bipolar, NPN, 40−V, 200−mA,
225−W
SOT23 MMBT3904LT1 On Semi
6 R1, R2, R5, R6,
R7, R8
Resistor, chip, 2 kΩ, 1/10−W,
5%
2K 805 Std Std
2 R3, R4 Resistor, chip, 0 Ω, 1/10−W, 5% 0 805 Std Std
6 S1, S2, S3, S4,
S5, S6
Switch, 1P2T, slide, PC−mount,
200−mA
TH EG1218 E_Switch
3 TP1, TP11, TP20 Test point, black, 1 mm TH 240−333 Farnell
17 TP2, TP3, TP4,
TP5, TP6, TP7,
TP8, TP9, TP10,
TP12, TP13,
TP14, TP15,
TP16, TP17,
TP18, TP19
Test point, red, 1 mm TH 240−345 Farnell
1 U1 IC, TPS2231
ExpressCard power interface
PWP24 TPS2231PWP TI
1 U2 IC, Single bus buffer gate with
3-state output
DBV SN74LVC1G240DBV TI
1 U4 IC, Single bus buffer gate with
3-state output
DBV SN74LVC1G125DBV TI
1 U3 Oscillator, 10-MHz, 3.3-V
version
SMD ECS−3953M ECS
6 Bumbers, clear, polyurethane SDM 2566 SPC
Technology
1 −− PCB,
6.45 in. × 3.95 in. × 0.062 in.
HPA074A Any
Notes: 1) These assemblies are ESD sensitive, ESD precautions must be observed.
2) These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.
3) These assemblies must comply with workmanship standards IPC−A−610 Class 2.
4) Reference designators marked with double asterisks (**) cannot be substituted. All other components can be substi-
tuted with equivalent manufacturers components.