Datasheet

www.ti.com
OC1, OC2, OC3, OC4
EN1, EN2, EN3, EN4
ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
TPS2070
TPS2071
SLVS287B SEPTEMBER 2000 REVISED SEPTEMBER 2007
OCx is an output signal that is asserted (active low) when an overcurrent or overtemperature condition is
encountered for the corresponding channel. OCx remains asserted until the overcurrent or overtemperature
condition is removed.
The active-low logic input ENx enables or disables the power switches in the device. The enable input is
compatible with both TTL and CMOS logic levels. The switches do not turn on until 3.3V_OUT is above the PG
threshold.
over operating free-air temperature range (unless otherwise noted)
(1) (2)
VALUE UNIT
Input voltage range V
I(BP)
, V
I(SP)
, V
I(ENx)
, V
I(EN_REG)
, V
I(BP_DIS)
0.3 to 6 V
V
I(VEXT)
0.3 to 10 V
Output voltage range V
O(OUTx),
V
O(3.3V_OUT)
, V
O(PG_DLY)
, V
O(OCx)
, V
O(BPMODE)
, V
O(DP0_RST)
, 0.3 to 6 V
V
O(PG)
V
O(GATE)
, V
O(CP_M)
, V
O(CP_P)
, V
O(VCP)
0.3 to 15 V
Continuous output current I
O(OUTx)
Internally limited
I
O(3.3V_OUT)
Internally limited
Maximum output current I
O(VCP)
± 30 mA
I
O(BPMODE)
or I
O(BPMODE)
, I
O(DP0_RST)
, I
O(PG)
, I
O(OCx)
± 10 mA
I
O(GATE
), sourcing 700 μ A
I
O(GATE)
, sinking 2.2 mA
Continuous total power dissipation See Dissipation Rating Table
Operating virtual junction temperature range, T
J
40 to 125 ° C
Storage temperature range, T
stg
65 to 150 ° C
Lead temperature (soldering), 1,6 mm (1/16 inch) from case for 10 seconds 260 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND.
T
A
25 ° C DERATING FACTOR T
A
= 70 ° C T
A
= 85 ° C
PACKAGE
POWER RATING ABOVE T
A
= 25 ° C POWER RATING POWER RATING
32-DAP 1162.8 mW 11.6 mW/ ° C 639.5 mW 465.1 mW
32-DAP
(1)
4255.3 mW 42.5 mW/ ° C 2340.4 mW 1702.1 mW
(1) Using thermal pad as heatsink.
6 Submit Documentation Feedback Copyright © 2000 2007, Texas Instruments Incorporated
Product Folder Link(s): TPS2070 TPS2071