Datasheet

TPS2060, TPS2064
TPS2068, TPS2069
SLVS553K – MARCH 2005– REVISED MAY 2011 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE OPTION AND ORDERING INFORMATION
RECOMMENDED TYPICAL PACKAGED
MAXIMUM SHORT-CIRCUIT NUMBER OF DEVICES
(1) (2)
T
A
ENABLE
CONTINUOUS CURRENT LIMIT SWITCHES
MSOP (DGN) SON (DRB)
LOAD CURRENT AT 25°C
Active low TPS2060DGN TPS2060DRB
0°C to 70°C Dual
Active high TPS2064DGN TPS2064DRB
Active low 1.5 A 2.1 A TPS2068DGN
–40°C to 85°C Single
Active high TPS2069DGN
0°C to 70°C Active low Single TPS2068D
(1) The package is available taped and reeled. Add an R suffix to device types (e.g., TPS2060DGN).
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
UNIT
Input voltage range, V
I(IN)
–0.3 V to 6 V
V
I
Input voltage range, V
I(/ENx)
, V
I(ENx)
–0.3 V to 6 V
Voltage range, V
I(/OC)
, V
I(/OCx)
–0.3 V to 6 V
V
O
Output voltage range, V
O(OUT)
, V
O(OUTx)
–0.3 V to 6 V
I
O
Continuous output current, I
O(OUT)
, I
O(OUTx)
Internally limited
Continuous total power dissipation See Dissipation Rating Table
TPS2060/64 0°C to 105°C
Operating virtual junction temperature
T
J
TPS2068/69 (DGN Package) –40°C to 105°C
range
TPS2068 (D Package) 0°C to 105°C
T
stg
Storage temperature range –65°C to 150°C
Human body model MIL-STD-883C 2 kV
ESD Electrostatic discharge protection
Charge device model (CDM) 500 V
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATING RATING TABLE
(1)
THERMAL T
A
< 25°C DERATING T
A
= 70°C T
A
= 85°C
PACKAGE RESISTANCE POWER RATING FACTOR POWER RATING POWER RATING
θ
JA
ABOVE T
A
= 25°C
DGN-8
(2)
1370 mW 17 mW/°C 600 mW 342 mW
D-8 585.82 mW 5.8582 mW/°C 322.20 mW 234.32 mW
DRB-8 (Low-K)
(3)
270 °CW 370 mW 3.71 mW/°C 203 mW 148 mW
DRB-8 (High-K)
(4)
60 °CW 1600 mW 16.67 mW/°C 916 mW 866 mW
(1) Heatsink the PowerPad™per the recommendations of SLMA002. PCB used for recommendations per appendix A4.
(2) See Recommended Operating Conditions Table for PowerPad connection guidelines to meet qualifying conditions for CB Certificate.
(3) Soldered PowerPAD on a standard 2-layer PCB without vias for thermal pad. See TI application note SLMA002 for further details.
(4) Soldered PowerPAD on a standard 4-layer PCB with vias for thermal pad. See TI application note SLMA002 for further details.
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