Datasheet

−2
0
2
4
6
8
−3m −2m −1m 0 1m 2m 3m 4m 5m
ENx
OUTx
Time (s)
ENx (V)
V
IN
= 5 V, C
Lx
= 1 µF, R
Loadx
= 5 Ω, TPS2062C
−2
0
2
4
6
8
−3m −2m −1m 0 1m 2m 3m 4m 5m
ENx
OUTx
Time (s)
ENx (V)
V
IN
= 5 V, C
Lx
= 1 µF, R
Loadx
= 5 Ω, TPS2062C
OUT1
IN
GND
FLT1
C
L1
3 . 0 1 k
Control Signals
V
IN
0.1
F
Fault Signals
Pad
V
OUT1
EN1 or EN1
FLT2
EN2 or EN2
C
L2
V
OUT2
OUT2
R L
o a d 2
R L
o a d 1
I
OUT1
I
OUT2
3 . 0 1 k
TPS2052C, TPS2062C, TPS2062C-2
TPS2066C, TPS2066C-2, TPS2060C, TPS2064C
TPS2064C-2, TPS2002C, TPS2003C
SLVSAX6G –OCTOBER 2011–REVISED JANUARY 2013 www.ti.com
PIN FUNCTIONS – SON-8 PACKAGES
NAME TPS2062C-2 I/O DESCRIPTION
GND 1 Pwr Ground connection
IN 2 I Input voltage and power-switch drain; connect a 0.1 µF or greater ceramic capacitor from
IN to GND close to the IC
EN1 3 I Enable input channel 1, logic low turns on power switch
EN2 4 I Enable input channel 2, logic low turns on power switch
FLT2 5 O Active-low open-drain output, asserted during over-current, or over-temperature conditions
on channel 2
OUT2 6 O Power-switch output channel 2, connect to load
OUT1 7 O Power-switch output channel 1, connect to load
FLT1 8 O Active-low open-drain output, asserted during over-current, or over-temperature conditions
on channel 1
PowerPAD™ PAD Pwr Internally connected to GND; used to heat-sink the part to the circuit board traces.
Connect PAD to GND plane as a heatsink.
spacer
TYPICAL CHARACTERISTICS
Figure 10. Test Circuit for System Operation in Typical Characteristics Section
Figure 11. TPS2062C Turn on Delay and Figure 12. TPS2062C Turn off Delay and
Rise Time With 1-μF Load Fall Time With 1-μF Load
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Product Folder Links: TPS2052C TPS2062C TPS2062C-2 TPS2066C TPS2066C-2 TPS2060C TPS2064C
TPS2064C-2 TPS2002C TPS2003C