Datasheet

TPS2052C, TPS2062C, TPS2062C-2
TPS2066C, TPS2066C-2, TPS2060C, TPS2064C
TPS2064C-2, TPS2002C, TPS2003C
www.ti.com SLVSAX6G –OCTOBER 2011–REVISED JANUARY 2013
DEVICE INFORMATION
PIN FUNCTIONS – MSOP-8 PACKAGES
TPS2052C
TPS2066C
TPS2062C
NAME TPS2066C-2 I/O DESCRIPTION
TPS2060C
TPS2064C
TPS2064C-2
GND 1 1 Pwr Ground connection
IN 2 2 I Input voltage and power-switch drain; connect a 0.1 µF or greater ceramic capacitor from IN to
GND close to the IC
EN1 3 - I Enable input channel 1, logic high turns on power switch
EN1 - 3 I Enable input channel 1, logic low turns on power switch
EN2 4 - I Enable input channel 2, logic high turns on power switch
EN2 - 4 I Enable input channel 2, logic low turns on power switch
FLT2 5 5 O Active-low open-drain output, asserted during overcurrent, or overtemperature conditions on
channel 2
OUT2 6 6 O Power-switch output channel 2, connected to load
OUT1 7 7 O Power-switch output channel 1, connected to load
FLT1 8 8 O Active-low open-drain output, asserted during over-current, or overtemperature conditions on
channel 1
PowerPAD™ PAD PAD Pwr Internally connected to GND; used to heat-sink the part to the circuit board traces. Connect
PAD to GND plane as a heatsink.
PIN FUNCTIONS – SOIC-8 PACKAGES
NAME TPS2066C TPS2062C I/O DESCRIPTION
GND 1 1 Pwr Ground connection
IN 2 2 I Input voltage and power-switch drain; connect a 0.1 µF or greater ceramic capacitor from IN to
GND close to the IC
EN1 3 - I Enable input channel 1, logic high turns on power switch
EN1 - 3 I Enable input channel 1, logic low turns on power switch
EN2 4 - I Enable input channel 2, logic high turns on power switch
EN2 - 4 I Enable input channel 2, logic low turns on power switch
FLT2 5 5 O Active-low open-drain output, asserted during overcurrent, or overtemperature conditions on
channel 2
OUT2 6 6 O Power-switch output channel 2, connected to load
OUT1 7 7 O Power-switch output channel 1, connected to load
FLT1 8 8 O Active-low open-drain output, asserted during overcurrent, or overtemperature conditions on
channel 1
PIN FUNCTIONS – SON-10 PACKAGES
NAME TPS2003C TPS2002C I/O DESCRIPTION
GND 1 1 Pwr Ground connection
IN 2, 3 2, 3 I Input voltage and power-switch drain; connect a 0.1 µF or greater ceramic capacitor from IN to
GND close to the IC
EN1 4 – I Enable input channel 1, logic high turns on power switch
EN1 – 4 I Enable input channel 1, logic low turns on power switch
EN2 5 – I Enable input channel 2, logic high turns on power switch
EN2 – 5 I Enable input channel 2, logic low turns on power switch
FLT2 6 6 O Active-low open-drain output, asserted during overcurrent, or overtemperature conditions on
channel 2
NC 7 7 No connect – leave floating.
OUT2 8 8 O Power-switch output channel 2, connect to load
OUT1 9 9 O Power-switch output channel 1, connect to load
FLT1 10 10 O Active-low open-drain output, asserted during overcurrent, or overtemperature conditions on
channel 1
PowerPAD™ PAD PAD Pwr Internally connected to GND; used to heat-sink the part to the circuit board traces. Connect
PAD to GND plane as a heatsink.
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Product Folder Links: TPS2052C TPS2062C TPS2062C-2 TPS2066C TPS2066C-2 TPS2060C TPS2064C
TPS2064C-2 TPS2002C TPS2003C