Datasheet
Table Of Contents
- FEATURES
- DESCRIPTION
- FUNCTIONAL BLOCK DIAGRAMS
- DETAILED DESCRIPTION
- ABSOLUTE MAXIMUM RATINGS
- DISSIPATION RATING TABLE
- RECOMMENDED OPERATING CONDITIONS
- ELECTRICAL CHARACTERISTICS OVER RECOMMENDED OPERATING JUNCTION TEMPERATURE RANGE
- ENABLE INPUT ENx OR ENx
- CURRENT LIMIT
- SUPPLY CURRENT (TPS2045A, TPS2055A)
- SUPPLY CURRENT (TPS2046A, TPS2056A)
- SUPPLY CURRENT (TPS2047A, TPS2057A)
- SUPPLY CURRENT (TPS2048A, TPS2058A)
- UNDERVOLTAGE LOCKOUT
- OVERCURRENT OC
- PARAMETER MEASUREMENT INFORMATION
- TYPICAL CHARACTERISTICS
- APPLICATION INFORMATION
- POWER-SUPPLY CONSIDERATIONS
- OVERCURRENT
- OC RESPONSE
- POWER DISSIPATION AND JUNCTION TEMPERATURE
- THERMAL PROTECTION
- UNDERVOLTAGE LOCKOUT (UVLO)
- UNIVERSAL SERIAL BUS (USB) APPLICATIONS
- HOST/SELF-POWERED AND BUS-POWERED HUBS
- LOW-POWER BUS-POWERED FUNCTIONS AND HIGH-POWER BUS-POWERED FUNCTIONS
- USB POWER-DISTRIBUTION REQUIREMENTS
- GENERIC HOT-PLUG APPLICATIONS (see )
PACKAGE OPTION ADDENDUM
www.ti.com
20-Aug-2011
Addendum-Page 2
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TPS2055ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS2056AD NRND SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS2056ADG4 NRND SOIC D 8 75 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS2056ADR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS2056ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS2057AD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS2057ADG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS2057ADR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS2057ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS2058AD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS2058ADG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.