Datasheet

Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TPS2051BDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TPS2051BDBVT SOT-23 DBV 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TPS2051BDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TPS2051BDGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS2051BDGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1
TPS2051BDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TPS2052BDGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1
TPS2052BDGNR MSOP-
Power
PAD
DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
TPS2052BDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
TPS2052BDRBR SON DRB 8 3000 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q2
TPS2052BDRBT SON DRB 8 250 180.0 12.4 3.3 3.3 1.0 8.0 12.0 Q2
TPS2053BDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
TPS2054BDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 28-Sep-2012
Pack Materials-Page 2