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3.1 Layout Considerations
4 Bill of Materials and Schematics
4.1 Bill of Materials
4.1.1 TPS2041B EVM BOM
Bill of Materials and Schematics
Figure 7. Bottom-Side Layout of TPS2051B EVM
1. All leads should be as short as possible with wide traces.
2. Pair signals to reduce emissions and noise, especially the paths that carry high-current pulses; these
include paths to power semiconductors and magnetics.
3. Reduce the length of all the traces in described step 2.
4. Where possible, use vertical pairing.
This chapter provides the Bill of Materials and Schematics for the TPS2041B/51B EVMs.
Table 1 is the Bill of Materials for the TPS2041B EVM.
Table 1. TPS2041B EVM BOM
RefDes Count Size Mfr Part Number Description
C1 1 SMD STD STD Capacitor, tantalum, 150- µ F, 10-V, 100-m Ω , 20%
C2, C3 2 0805 STD STD Capacitor, ceramic, 0.1- µ F, 10-V, 20%
C4 1 1206 STD STD Capacitor, ceramic, 10- µ F, 10-V, 20%
R1 1 0805 STD STD Resistor, chip, 10-k Ω , 1/10W, 5%
TP1, TP3, TP4, TP5 4 TH Keystone 5000 Test point, red, thru hole, color keyed
TP2, TP7, TP8, TP9 4 TH Keystone 5001 Test point, black, thru hole, color keyed
U1 1 SOT-23-5 TI TPS2041BDBV IC, 80-m Ω , 500-mA power-distribution single switch
– 1 Any HPA228 PCB, 1 in. × 0.8 in. x 0.062 in. (2,54 cm × 2,03 cm × 1,58 mm)
NOTES: 1. These assemblies are ESD sensitive; ESD precautions must be observed.
2. These assemblies must be clean and free from flux and all contaminants. Use of no-clean flux is not acceptable.
3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.
TPS2041B/51B EVM Power-Distribution Switch6 SLVU199A – March 2007 – Revised June 2007
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