Datasheet

TPS2010, TPS2011, TPS2012, TPS2013
POWER-DISTRIBUTION
SLVS097A – DECEMBER 1994 – REVISED AUGUST 1995
14
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TYPICAL CHARACTERISTICS
Figure 27
3.5
3
2
1.5
2.5 3 3.5 4
Threshold Trip Current – A
4
5
THRESHOLD TRIP CURRENT
vs
INPUT VOLTAGE
5.5
4.5 5 5.5
4.5
2.5
TPS2010
TPS2013
TPS2012
TPS2011
V
I
– Input Voltage – V
Figure 28
1.5
1
0.5
0
Short-Circuit Current – A
2
2.5
SHORT-CIRCUIT CURRENT
vs
JUNCTION TEMPERATURE
3
–50 –25 0 25 50 75 100 125
T
J
– Junction Temperature – °C
TPS2013
TPS2012
TPS2011
TPS2010
V
I(IN)
= 5.5 V
APPLICATION INFORMATION
0.1 µF
External Load
+
0.1 µF1 µF
Power Supply
2.7 V – 5.5 V
Load Enable
IN
IN
EN
OUT
OUT
OUT
OUT
GND
TPS2010D
2
3
4
5
6
7
8
1
Figure 29. Typical Application
power supply considerations
The TPS201x family has multiple inputs and outputs, which must be connected in parallel to minimize voltage
drop and prevent unnecessary power dissipation.
A 0.047-µF to 0.1-µF ceramic bypass capacitor between IN and GND, close to the device, is recommended.
A high-value electrolytic capacitor is also desirable when the output load is heavy or has large paralleled
capacitors. Bypassing the output with a 0.1-µF ceramic capacitor improves the immunity of the device to
electrostatic discharge (ESD).