Datasheet

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PCB Layout
Application Using a Multilayer PCB
PackageThermalPad
SolderPad(LandPattern)
ThermalVias
PackageOutline
PowerPad
PackageSolderPad
PackageSolderPad
(BottomTrace)
ThermalVia
ComponentTraces
ThermalIsolation
PowerPlaneOnly
1.5748mm
0.0 0.071-mmBoardBase–
andBottomPad
0.5246 0.5606-mm–
PowerPlane
(1-ozCu)
1.0142 1.0502-mm–
GroundPlane
(1-ozCu)
1.5038 1.5748-mm–
ComponentTrace
(2-ozCu)
2Plane
4Plane
Application Using a Single-Layer PCB
TPL9202
8-CHANNEL RELAY DRIVER
WITH INTEGRATED 5-V LDO AND BROWN-OUT DETECTION
SLIS124D – JUNE 2006 – REVISED FEBRUARY 2008
To maximize the efficiency of this package for application on a single layer or multilayer PCB, certain guidelines
must be followed when laying out this part on the PCB.
The following information is to be used as a guideline only.
For further information, see the PowerPAD concept implementation document.
In a multilayer board application, the thermal vias are the primary method of heat transfer from the package
thermal pad to the internal ground plane (see Figure 4 and Figure 5 ).
The efficiency of this method depends on several factors: die area, number of thermal vias, thickness of copper,
etc. (see the PowerPAD™ Thermally Enhanced Package Technical Brief, literature number SLMA002 ).
Figure 4. Package and PCB Land Configuration for a Multilayer PCB
Figure 5. Multilayer Board (Side View)
In a single-layer board application, the thermal pad is attached to a heat spreader (copper areas) by a low
thermal-impedance attachment method (solder paste or thermal conductive epoxy). With either method, it is
advisable to use as many copper traces as possible to dissipate the heat.
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Product Folder Link(s): TPL9202