Datasheet
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ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATING TABLE
RECOMMENDED OPERATING CONDITIONS
TPIC74100-Q1
BUCK/BOOST SWITCH-MODE REGULATOR
SLIS125 – DECEMBER 2006
over recommended operating free-air temperature range (unless otherwise noted)
(1)
Unregulated input voltage, V
(driver)
(2)
–0.5 V to 40 V
Unregulated inputs, V
(AIN)
, V
(ENABLE)
(2)
–0.5 V to 40 V
Bootstrap voltages V
(Cboot1)
52 V
V
(Cboot2)
14 V
Switch mode voltages V
(L1)
–1 V to 40 V
V
(L2)
–1 V to 7 V
Logic input voltages, V
(Rmod)
,V
(SCR0)
,V
(SCR1)
,V
(CLP)
, and V
(5Vg_ENABLE)
(2)
–0.5 V to 7 V
Low output voltages, V
(RESET)
,V
(AOUT)
,V
(logic)
, and V
(REST)
(2)
–0.5 V to 7 V
Electrostatic-discharge V
(HBMESD)
(3)
, pin 7 (L2), pin 8 (V
OUT
), pin 9 (5Vg) 800 V
susceptibility
V
(HBMESD)
(3)
, pins 1–6 and 10–20 2 kV
Thermal impedance, junction-to-case, R
θ JC
(4)
2°C/W
Thermal impedance, R
θ JA
(4)
32°C/W
junction-to-ambient
R
θ JA
(5)
40°C/W
Continuous power dissipation, P
D
See Dissipation
Rating Table
Operating virtual junction temperature range, T
J
–40°C to 150°C
Operating ambient temperature range, T
A
–40°C to 125°C
Storage temperature range, T
stg
–65°C to 125°C
Lead temperature (soldering, 10 s), T
(LEAD)
260°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to ground.
(3) The human body model is a 100-pF capacitor discharged through a 1.5-k Ω resistor into each terminal.
(4) The thermal data is based on using 2-oz. copper trace with at least four square inches of copper footprint for heat dissipation. The
copper pad is soldered to the thermal land pattern. Correct attachment procedure must be incorporated.
(5) The thermal data is based on using 1-oz. copper trace with at least four square inches of copper footprint for heat dissipation. The
copper pad is soldered to the thermal land pattern. Correct attachment procedure must be incorporated.
R
θ JA
T
A
≤ 25°C Power Rating Derating Factor Above T
A
= 25°C T
A
= 85°C Power Rating T
A
= 125°C Power Rating
32°C/W 3.9 W 31.25 mW/°C 2.03 W 0.781 W
40°C/W 3.125 W 25 mW/°C 1.625 W 0.625 W
MIN MAX UNIT
Unregulated input voltage, V
(driver)
6 24 V
Unregulated input voltages, V
(AIN)
and V
(ENABLE)
0 24 V
V
(L1)
–1 17
Switch-mode terminals V
V
(L2)
5 5.5
V
(Cboot1)
V
(driver)
+ 10
Bootstrap voltages V
V
(Cboot2)
8
Logic levels (I/O), V
(Rmod)
, V
(logic)
,V
(SCR0)
,V
(SCR1)
,V
(5Vg_ENABLE)
,V
(RESET)
, V
(AOUT)
, V
(CLP)
, and
0 5.25 V
V
(REST)
Operating ambient temperature range, T
A
–40 125 °C
Logic levels (I/O), V
(SCR0)
, V
(SCR1)
, V
(CLP)
directly connected to V
(logic)
V
(logic)
V
(logic)
V
4
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