Datasheet
www.ti.com
M0028-01
UseasMuchCopper Area
asPossibleforHeatSpread
PackageThermalPad
PackageOutline
IMPORTANT
TPIC74100-Q1
BUCK/BOOST SWITCH-MODE REGULATOR
SLIS125 – DECEMBER 2006
APPLICATION INFORMATION (continued)
Figure 23. Land Configuration for Single-Layer PCB
Layout recommendation is to use as much copper area for the power-management section of a single-layer
board as possible. In a single-layer board application, the thermal pad is attached to a heat spreader (copper
areas) by using a low-thermal-impedance attachment method (solder paste or thermal-conductive epoxy). In
both of these cases, it is advisable to use as much copper and as many traces as possible to dissipate the heat.
When this attachment method is not implemented correctly, this product may operate inefficiently. Power dissipation capability
may be adversely affected when the device is incorrectly mounted onto the circuit board.
23
Submit Documentation Feedback