Datasheet

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APPLICATION INFORMATION

M0026-01

PackageThermalPad

SolderPad(LandPattern)

ThermalVias

PackageOutline

M0027-01

PowerPad

PackageSolderPad

(BottomTrace)

ThermalVia

ComponentTraces

ThermalIsolation

PowerPlaneOnly

1,5748mm

0-mm 0,071-mmBoard

Base

–

andBottomPad

0,5246-mm 0,5606-mm–

PowerPlane

(1-oz.Cu)

1,0142-mm 1,0502-mm–

GroundPlane

(1-oz.Cu)

1,5038-mm 1,5748-mm–

ComponentTrace

(2-oz.Cu)

2Plane

4Plane

TPIC74100-Q1

BUCK/BOOST SWITCH-MODE REGULATOR

SLIS125 – DECEMBER 2006

To maximize the efficiency of this package for application on a single-layer or multilayer PCB, certain guidelines

must be followed when laying out this device on the PCB.

The following information is to be used as a guideline only.

For further information see the PowerPAD Thermally Enhanced Package technical brief (SLMA002 ).

The following are guidelines for mounting the PowerPAD™ IC on a multilayer PCB with a ground plane.

Figure 21. Package and PCB Land Configuration for a Multilayer PCB

Figure 22. Multilayer Board (Side View)

In a multilayer board application, the thermal vias are the primary method of heat transfer from the package

thermal pad to the internal ground plane.

The efficiency of this method depends on several factors (die area, number of thermal vias, thickness of copper,

etc.). See the PowerPAD Thermally Enhanced Package technical brief (SLMA002).

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