Datasheet
IO3
IO4
GND
IO2
IO1
0.1µF
V
CC
USB
Controller
R
T
V
BUS
D+
D–
GND
V
BUS
D+
D–
GND
D1
TPD4E001
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SLLS682K –JULY 2006–REVISED JANUARY 2015
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
TPD4E001 is a diode array type Transient Voltage Suppressor (TVS) which is typically used to provide a path to
ground for dissipating ESD events on hi-speed signal lines between a human interface connector and a system.
As the current from ESD passes through the TVS, only a small voltage drop is present across the diode. This is
the voltage presented to the protected IC. The low R
DYN
of the triggered TVS holds this voltage, V
CLAMP
, to a
tolerable level to the protected IC.
8.2 Typical Application
Figure 4. Typical Application Schematic
8.2.1 Design Requirements
For this design example, a single TPD4E001 is used to protect all the pins of two USB2.0 connectors.
Given the USB application, the following parameters are known.
Table 1. Design Parameters
DESIGN PARAMETER VALUE
Signal range on IO1, IO2, IO3, and IO4 0 V to 3.6 V
Signal voltage range on V
CC
0 V to 5.25 V
Operating Frequency 240 MHz
8.2.2 Detailed Design Procedure
When placed near the USB connectors, the TPD4E001 ESD solution offers little or no signal distortion during
normal operation due to low IO capacitance and ultra-low leakage current specifications. The TPD4E001 ensures
that the core circuitry is protected and the system is functioning properly in the event of an ESD strike. For
proper operation, the following layout/ design guidelines should be followed:
1. Place the TPD4E001 solution close to the connectors. This allows the TPD4E001 to take away the energy
associated with ESD strike before it reaches the internal circuitry of the system board.
2. Place a 0.1-μF capacitor very close to the V
CC
pin. This limits any momentary voltage surge at the IO pin
during the ESD strike event.
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