*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPA751DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0
TPA751DR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 29-Jul-2011
Pack Materials-Page 2
