Datasheet

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     
  
SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
AVAILABLE OPTIONS
PACKAGED DEVICES
MicroStar-Junior (BGA)
‡
(GQS)
SMALL OUTLINE
†
(D)
MSOP
‡
(DGN)
Device TPA751GQS TPA751D TPA751DGN
Package symbolization TPA751 TPA751 ATC
†
In the SOIC package, the maximum RMS output power is thermally limited to 350 mW; 700 mW peaks can be driven, as long
as the RMS value is less than 350 mW.
‡
The D, DGN, and GQS packages are available taped and reeled. To order a taped and reeled part, add the suffix R to the
part number (e.g., TPA751DR).
Terminal Functions
TERMINAL
NAME
NO.
I/O DESCRIPTION
NAME
GQS D, DGN
I/O
DESCRIPTION
BYPASS E3 2 I
BYPASS is the tap to the voltage divider for internal mid-supply bias. This terminal should be
connected to a 0.1-µF to 2.2-µF capacitor when used as an audio amplifier.
GND § 7 GND is the ground connection.
IN− E5 4 I IN− is the inverting input. IN− is typically used as the audio input terminal.
IN+ E4 3 I IN+ is the noninverting input. IN+ is typically tied to the BYPASS terminal for SE input.
SHUTDOWN E2 1 I SHUTDOWN places the entire device in shutdown mode when held low (I
DD
= 1.5 nA).
V
DD
A4 6 V
DD
is the supply voltage terminal.
V
O
+ A5 5 O V
O
+ is the positive BTL output.
V
O
− A2 8 O V
O
− is the negative BTL output.
§
A1, A3, A5, B1−B5, C1−C5, D1−D5 are electrical and thermal connections to the ground plane.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
¶
Supply voltage, V
DD
6 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage, V
I
−0.3 V to V
DD
+0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous total power dissipation Internally limited (see Dissipation Rating Table). . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range, T
A
−40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating junction temperature range, T
J
−40°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
−65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
¶
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE
T
A
= 25°C DERATING FACTOR T
A
= 70°C T
A
= 85°C
GQS
||
1.66 W
||
13.3 mW/°C 1.06 W 866 mW
D 725 mW 5.8 mW/°C 464 mW 377 mW
DGN 2.14 W
#
17.1 mW/°C 1.37 W 1.11 W
#
See the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report
(SLMA002), for more information on the PowerPAD package. The thermal data was measured on a PCB
layout based on the information in the section entitled Texas Instruments Recommended Board for PowerPAD
on page 33 of that document.
||
See the Texas Instruments document, MicroStar Junior Made Easy Application Brief (SSYA009A) for board
layout information on the MicroStar Junior package.