User’s Guide November 2000 Mixed-Signal Products SLOU088
IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete.
Information About Cautions and Warnings Preface Read This First Information About Cautions and Warnings This book may contain cautions and warnings. This is an example of a caution statement. A caution statement describes a situation that could potentially damage your software or equipment. This is an example of a warning statement. A warning statement describes a situation that could potentially cause harm to you. The information in a caution or a warning is provided for your protection.
FCC Warning FCC Warning This equipment is intended for use in a laboratory test environment only. It generates, uses, and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable protection against radio frequency interference.
Running Title—Attribute Reference Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Feature Highlights . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 TPA731 EVM Specifications .
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Chapter 1 Introduction This chapter provides an overview of the Texas Instruments (TI) TPA731 MSOP audio amplifier evaluation module (SLOP342). It includes a list of EVM features, a brief description of the module illustrated with a pictorial diagram, and a list of EVM specifications. Topic Page 1.1 Feature Highlights . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2 1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Feature Highlights 1.1 Feature Highlights The TI TPA731 MSOP audio amplifier evaluation module and the TI plug-n-play audio amplifier evaluation platform include the following features: TPA731 low-voltage audio power amplifier evaluation module Single channel, bridge-tied load (BTL) 2.5-V and 5.
Description 1.2 Description The TPA731 MSOP audio power amplifier evaluation module is a complete, low-power single-channel audio power amplifier. It consists of the TI TPA731 700-mW low-voltage audio power amplifier IC in a very small MSOP package, along with a small number of other parts mounted on a circuit board that is approximately one and a quarter inches square (see Figure 1–1). Figure 1–1.
1-4 Introduction
Chapter 2 Operation Follow the steps in this chapter to quickly prepare the TPA731 MSOP audio amplifier EVM for use. Using the TPA731 MSOP EVM with the TI plug-n-play audio amplifier evaluation platform is a quick and easy way to connect power, signal and control inputs, and signal outputs to the EVM, using standard connectors.
Precautions 2.1 Precautions Power Supply Input Polarity and Maximum Voltage Always ensure that the polarity and voltage of the external power connected to VCC power input connector J1, J2, and/or VDD power input connector J6 are correct. Overvoltage or reverse-polarity power applied to these terminals can open onboard soldered-in fuses and cause other damage to the platform, installed evaluation modules, and/or the power source.
Quick Start List for Platform 2.2 Quick Start List for Platform Follow these steps when using the TPA731 MSOP EVM with the TI plug-n-play audio amplifier evaluation platform (see the platform user’s guide, SLOU011, for additional details). Numbered callouts for selected steps are shown in Figure 2–1 and details appear in Chapter 3. Platform preparations 1) Ensure that all external power sources are set to off and that the platform power switch S1 is set to off.
Quick Start List for Stand-Alone 2.3 Quick Start List for Stand-Alone Follow these steps to use the TPA731 MSOP EVM stand-alone or when connecting it into existing circuits or equipment. Connections to the TPA731 MSOP module header pins can be made via individual sockets, wire-wrapping, or soldering to the pins, either on the top or the bottom of the module circuit board. Numbered callouts for selected steps are shown in Figure 2–2. Figure 2–2.
Reference 2.4 Reference 2.4.1 TPA731 MSOP EVM Connected for BTL Output Figure 2–3.
Reference 2.4.2 TPA731 MSOP EVM Schematic Diagram Figure 2–4. TPA731 MSOP EVM Schematic Diagram S1 NO Shutdown 1 2 R1 20 kΩ C1 C2 1 µF 1 µF 3 R2 39 kΩ 4 GND C3 1 µF Shutdown VO – Bypass GND In+ VDD In – VO + 7 6 5 OUT– C5 1 µF R3 20 kΩ GND OUT+ R5 39 kΩ Audio Input– R4 20 kΩ 2.4.3 VDD 2.5 V to 5.5 V C4 GND 10 µF + 8 C6 5 pF TPA731 MSOP Audio Power Amplifier Evaluation Module Parts List Table 2–3. TPA731 MSOP EVM Parts List Reference Description Size EVM Qty.
TPA731 MSOP EVM PCB Layers 2.4.4 TPA731 MSOP EVM PCB Layers The following illustrations depict the TPA731 EVM PCB layers and silkscreen. These drawings are not to scale. Gerber plots can be obtained from any TI sales office. Figure 2–5. TPA731 EVM PCB Figure 2–6.
TPA731 MSOP EVM PCB Layers Figure 2–7. TPA731 EVM Top Layer Figure 2–8.
