Datasheet

0,65 mm

0,38 mm

Solder Mask: 1,4 mm x 1,85 mm centered in package

0,7 mm

1,4 mm

Make solder paste a hatch pattern to fill 50%

3,3 mm

1,95 mm

0,33 mm plugged vias (5 places)

TPA6211A1

www.ti.com

SLOS367D –AUGUST 2003– REVISED JUNE 2011

PCB LAYOUT

Use the following land pattern for board layout with the 8-pin QFN (DRB) package. Note that the solder paste

should use a hatch pattern to fill solder paste at 50% to ensure that there is not too much solder paste under the

package.

Figure 36. TPA6211A1 8-Pin QFN (DRB) Board Layout (Top View)