Datasheet

(SIDEVIEW)
SHUTDOWN
IN+
V
DD
V
O+
GND
V
O-
IN-
A
B
C
1 2 3
BYPASS
8
SHUTDOWN
BYPASS
IN+
IN-
V
O-
GND
V
DD
V
O+
7
6
5
1
2
3
4
7
6
5
1
2
3
SHUTDOWN
BYPASS
IN+
IN-
V
O-
GND
V
DD
V
O+
4
8
TPA6203A1
SLOS364F – MARCH 2002 – REVISED JUNE 2008 .......................................................................................................................................................... www.ti.com
MicroStar Junior™ (GQV or ZQV) PACKAGE
(TOP VIEW)
8-PIN QFN (DRB) PACKAGE
(TOP VIEW)
8-PIN MSOP (DGN) PACKAGE
(TOP VIEW)
Terminal Functions
TERMINAL
I/O DESCRIPTION
DRB,
NAME GQV
DGN
BYPASS C1 2 I Mid-supply voltage. Adding a bypass capacitor improves PSRR.
GND B2 7 I High-current ground
IN- C3 4 I Negative differential input
IN+ C2 3 I Positive differential input
SHUTDOWN B1 1 I Shutdown terminal (active low logic)
V
DD
A3 6 I Supply voltage terminal
V
O+
B3 5 O Positive BTL output
V
O-
A1 8 O Negative BTL output
Connect to ground. Thermal pad must be soldered down in all applications to properly secure device
Thermal Pad
on the PCB.
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Product Folder Link(s): TPA6203A1