Datasheet

8-Pin QFN (DRB) Layout
0.65mm
0.38mm
SolderMask:1.4mmx1.85mmcenteredinpackage
0.7mm
1.4mm
Makesolderpasteahatchpatterntofill50%
3.3mm
1.95mm
0.33mmpluggedvias(5places)
TPA6203A1
SLOS364F – MARCH 2002 – REVISED JUNE 2008 .......................................................................................................................................................... www.ti.com
Use the following land pattern for board layout with the 8-pin QFN (DRB) package. Note that the solder paste
should use a hatch pattern to fill solder paste at 50% to ensure that there is not too much solder paste under the
package.
Figure 35. TPA6203A1 8-Pin QFN (DRB) Board Layout (Top View)
16 Submit Documentation Feedback Copyright © 2002 – 2008, Texas Instruments Incorporated
Product Folder Link(s): TPA6203A1