Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- ABSOLUTE MAXIMUM RATINGS
- RECOMMENDED OPERATING CONDITIONS
- DISSIPATION RATINGS
- ELECTRICAL CHARACTERISTICS
- OPERATING CHARACTERISTICS
- TYPICAL CHARACTERISTICS
- TYPICAL CHARACTERISTICS
- APPLICATION INFORMATION
C1
C2
C3
B1
B3
A1
A3
0.25 mm 0.28 mm
0.38 mm
Solder Mask
Paste Mask (Stencil)
Copper Trace
B2
VIAS to Ground Plane
TPA6203A1
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.......................................................................................................................................................... SLOS364F – MARCH 2002 – REVISED JUNE 2008
Figure 34. MicroStar Junior™ BGA Recommended Layout
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Product Folder Link(s): TPA6203A1