Datasheet

DISSIPATION RATINGS TABLE
RECOMMENDED OPERATING CONDITIONS
ELECTRICAL CHARACTERISTICS
TPA6132A2
www.ti.com ........................................................................................................................................................................................... SLOS597 – DECEMBER 2008
T
A
≤ 25 ° C T
A
= 70 ° C T
A
= 85 ° C
PACKAGE DERATING FACTOR
(1)
POWER RATING POWER RATING POWER RATING
RTE (QFN) 2050 mW 48.7 ° C/W 1130 mW 821 mW
(1) See JEDEC Standard 51-3 for Low-K board, JEDEC Standard 51-7 for High-K board, and JEDEC Standard 51-12 for using package
thermal information. See JEDEC document page for downloadable copies: http://www.jedec.org/download/default .cfm.
MIN MAX UNIT
Supply voltage, VDD 2.3 5.5 V
V
IH
High-level input voltage; EN, G0, G1 1.3 V
V
IL
Low-level input voltage; EN, G0, G1 0.6 V
Voltage applied to Output; OUTR, OUTL (when EN = 0 V) – 0.3 3.6 V
T
A
Operating free-air temperature – 40 85 ° C
T
A
= 25 ° C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Output offset voltage – 0.5 0.5 mV
Power supply rejection ratio V
DD
= 2.3 V to 5.5 V 100 dB
High-level output current (EN, G0, G1) 1 µ A
Low-level output current (EN, G0, G1) 1 µ A
V
DD
= 2.3 V, No load, EN = V
DD
2.1 3.1
V
DD
= 3.6 V, No load, EN = V
DD
2.1 3.1 mA
Supply Current
V
DD
= 5.5 V, No load, EN = V
DD
2.2 3.2
EN = 0 V, V
DD
= 2.3 V to 5.5 V 0.7 1.2 µ A
Copyright © 2008, Texas Instruments Incorporated 5
Product Folder Link(s) :TPA6132A2