Datasheet

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VDD
GNDCPPCPN
LEFTINMLEFTINP
CPVSS
HPLEFT
RIGHTINMRIGHTINPGND
VDD
SD
SDASCL
HPRIGHT
A1 A2
A3
A4
B1 B2
B3
B4
C1 C2 C3 C4
D1 D2
D3
D4
Top(SymbolSide)ViewWCSP Package(YZH)
VDD
GND CPP CPN
LEFTINM LEFTINP
CPVSS
HPLEFT
RIGHTINM RIGHTINP GND
VDD
SD
SDA SCL HPRIGHT
A1A2
A3
A4
B1B2
B3
B4
C1C2C3C4
D1D2
D3
D4
Bottom(BallSide)ViewWCSP Package(YZH)
1
2
4
5
15
14
12
11
17
18
1920
9876
CPVSS
HPLEFT
HPRIGHT
RIGHTINP
LEFTINM
LEFTINP
RIGHTINM
T opView
VDD
3
GND
10
13
GND
16
VDD
GND CPP CPN CPVSS
SD
SDA
SCL
GND GND
TopViewQFNPackage(RTJ)
TPA6130A2
SLOS488B – NOVEMBER 2006 – REVISED FEBRUARY 2008
TERMINAL FUNCTIONS
TERMINAL INPUT/
OUTPUT/
DESCRIPTION
BALL
POWER
NAME PIN QFN
WCSP
(I/O/P)
Charge pump voltage supply. V
DD
must be connected to the common V
DD
voltage
V
DD
A4 20 P
supply. Decouple to GND (pin 19 on the QFN) with its own 1 µ F capacitor.
Charge pump ground. GND must be connected to common supply GND. It is
GND A3 19 P recommended that this pin be decoupled to the V
DD
of the charge pump pin (pin 20 on
the QFN).
Charge pump flying capacitor positive terminal. Connect one side of the flying capacitor
CPP A2 18 P
to CPP.
Charge pump flying capacitor negative terminal. Connect one side of the flying capacitor
CPN A1 17 P
to CPN.
Left channel negative differential input. Impedance must be matched to LEFTINP.
LEFTINM B4 1 I
Connect the left input to LEFTINM when using single-ended inputs.
Left channel positive differential input. Impedance must be matched to LEFTINM. AC
LEFTINP B3 2 I ground LEFTINP near signal source while maintaining matched impedance to LEFTINM
when using single-ended inputs.
Negative supply generated by the charge pump. Decouple to pin 19 on the QFN or a
CPVSS B2 15, 16 P
GND plane. Use a 1 µ F capacitor.
HPLEFT B1 14 O Headphone left channel output. Connect to left terminal of headphone jack.
Right channel negative differential input. Impedance must be matched to RIGHTINP.
RIGHTINM C4 5 I
Connect the right input to RIGHTINM when using single-ended inputs.
Right channel positive differential input. Impedance must be matched to RIGHTINM. AC
RIGHTINP C3 4 I ground RIGHTINP near signal source while maintaining matched impedance to
RIGHTINM when using single-ended inputs.
Analog ground. Must be connected to common supply GND. It is recommended that this
3, 9, 10,
GND C2 P pin be used to decouple V
DD
for analog. Use pin 13 to decouple pin 12 on the QFN
13
package.
Analog V
DD
. V
DD
must be connected to common V
DD
supply. Decouple with its own 1- µ F
V
DD
C1 12 P
capacitor to analog ground (pin 13 on the QFN).
SD D4 6 I Shutdown. Active low logic. 5V tolerant input.
SDA D3 7 I/O SDA - I
2
C Data. 5V tolerant input.
SCL D2 8 I SCL - I
2
C Clock. 5V tolerant input.
HPRIGHT D1 11 O Headphone light channel output. Connect to the right terminal of the headphone jack.
Thermal Solder the thermal pad on the bottom of the QFN package to the GND plane of the PCB.
N/A Die Pad P
pad It is required for mechanical stability and will enhance thermal performance.
Copyright © 2006 – 2008, Texas Instruments Incorporated 3
Product Folder Link(s): TPA6130A2