Datasheet

Bill of Materials
4-6
4.6 Bill of Materials
Table 4−1.TPA6120A2 EVM Bill of Materials
Component
Qty
Value
Size
Manufacturer Distributor
Componen
t
Qty Value Size
Name Number Name Number
C5, C6 2 10 µF, 50V, +80/−20%, F 1210 Panasonic ECJ−4YF1H106Z Digi−Key PCC2308TR−ND
C1, C2, C3,
C4
4 0.1 µF, 50V, ±10%, X7R 0805 Panasonic ECJ−2YB1H104K Digi−Key PCC1840TR−ND
C7, C8 2
100 µF, Aluminum
Electrolytic,
63V, ±20%
10 mm x
12.5 mm
Panasonic EEU−FC1J101 Digi−Key P10343−ND
L1, L2 2
Ferrite Bead, 330 Ω at
100 MHz, 2.5A
0805 TDK MPZ2012S331A Digi−Key 445−1569−2−ND
R1, R2, R3,
R4
4
1 kΩ, ±0.1%, 1/10W,
TCR = ±25 PPM/°C
0805
Thin-Film
Technology
RR1220P102B
Thin−Film
Technology
RR1220P102B
R5, R6 2
10 Ω, ±0.1%, 330 mW,
TCR = ±25 PPM/°C
1206 Vishay P1206E10R0BB
R7, R8 2
49.9 Ω, ±0.1%, 1/10W,
TCR = ±25 PPM/°C
0805
Thin-Film
Technology
RR1220P49R9B
Thin−Film
Technology
RR1220P49R9B
R11, R12 2 10 mΩ, ±2.0% 0805
Thin-Film
Technology
RL1220TR010G
Thin−Film
Technology
RL1220TR010G
R9, R10 2
4.02 kΩ, ±0.1%, 1/10W,
TCR = ±25 PPM/°C
0805
Thin-Film
Technology
RR1220P4021B
Thin−Film
Technology
RR1220P4021B
R13, R14 2 Do Not Populate 0805
R15, R16 2 Do Not Populate 1210
J1, J2, J3, J4,
J5, J6
6 RCA Jacks, Black Switch Craft PJRAN1X1U01
J7, J8, J9 3 Banana Jacks
USM
EYELETS
SE−68−Hot
Solder Dip
Bisco
SE−68−Hot
Solder Dip
J10 1 Headphone Jack 1/4” Switch Craft RN112BPC Digi−Key SC1123−ND
4 Aluminum Standoffs
1.00”
Round
4−40
Keystone 3482 Digi−Key 3482K−ND
4 Screws 1” #4
U1 1
IC high-fidelity
headphone driver
20 Pin
DWP
Texas
Instruments
TPA6120A2
PCB 1 2 layer 3” x 3”