Datasheet

TPA6110A2
SLOS314B –DECEMBER 2000– REVISED MARCH 2011 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
AVAILABLE OPTIONS
PACKAGED DEVICE
T
A
MSOP SYMBOLIZATION
MSOP
(1)
-40°C to 85°C TPA6110A2DGN TI AIZ
(1) The DGN package is available in left-ended tape and reel only (e.g., TPA6110A2DGNR).
PinFunctions
PIN
I/O DESCRIPTION
NAME NO.
Tap to voltage divider for internal mid-supply bias supply. Connect to a 0.1 µF to 1 µF low ESR capacitor
BYPASS 1 I
for best performance.
GND 2 I GND is the ground connection.
IN1– 8 I IN1– is the inverting input for channel 1.
IN2– 4 I IN2– is the inverting input for channel 2.
SHUTDOWN 3 I Puts the device in a low quiescent current mode when held high.
V
DD
6 I V
DD
is the supply voltage terminal.
V
O
1 7 O V
O
1 is the audio output for channel 1.
V
O
2 5 O V
O
2 is the audio output for channel 2.
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
UNIT
V
DD
Supply voltage 6 V
V
I
Input voltage –0.3 V to V
DD
+ 0.3 V
Continuous total power dissipation Internally limited
T
J
Operating junction temperature range -40°C to 150°C
T
stg
Storage temperature range -65°C to 150°C
(1) Stresses beyond those listed under "absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
T
A
≤ 25°C DERATING FACTOR T
A
= 70°C T
A
= 85°C
PACKAGE
POWER RATING ABOVE T
A
= 25°C POWER RATING POWER RATING
DGN 2.14 W
(1)
17.1 mW/°C 1.37 W 1.11 W
(1) See the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report (SLMA002), for more information on
the PowerPAD™ package. The thermal data was measured on a PCB layout based on the information in the section entitled Texas
Instruments Recommended Board for PowerPAD on page 33 of the before mentioned document.
RECOMMENDED OPERATING CONDITIONS
MIN MAX UNIT
V
DD
Supply voltage 2.5 5.5 V
T
A
Operating free-air temperature -40 85 °C
V
IH
High-level input voltage (SHUTDOWN) 60% x V
DD
V
V
IL
Low-level input voltage (SHUTDOWN) 25% x V
DD
V
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