Datasheet

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SLOS386A − NOVEMBER 2001 − REVISED APRIL 2007
24
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APPLICATION INFORMATION
crest factor and thermal considerations (continued)
T
A
Max + T
J
Max * Θ
JA
P
D
+ 150 * 45
(
0.6 2
)
+ 96°C
(
18 dB crest factor
)
(11)
NOTE:
Internal dissipation of 0.6 W is estimated for a 2-W system with 18 dB crest factor per channel.
Tables 3 and 4 show that for some applications no airflow is required to keep junction temperatures in the
specified range. The TPA6017A2 is designed with thermal protection that turns the device off when the junction
temperature surpasses 150°C to prevent damage to the IC. Tables 3 and 4 were calculated for maximum
listening volume without distortion. When the output level is reduced the numbers in the table change
significantly. Also, using 8-Ω speakers dramatically increases the thermal performance by increasing amplifier
efficiency.
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusions.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically
and thermally connected to the backside of the die and terminals 1, 12, 13, and 24. The dimensions of the thermal pad are
2.40 mm × 4.70 mm (maximum). The pad is centered on the bottom of the package.
E. Falls within JEDEC MO-153