Datasheet

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FUNCTIONAL BLOCK DIAGRAM
DATA1
BCLK1
LRCLK1
INPUT
BUFFER
OUTPUT
BUFFER
DATA_OUT1
CONTROL
2
3
I C
2
ADDx(2:0)
DELAY
MEMORY
DELAY
MEMORY
DATA2
BCLK2
LRCLK2
DATA_OUT2
ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
TPA5051
SLOS497A – JUNE 2006 – REVISED JULY 2006
over operating free-air temperature (unless otherwise noted)
(1)
VALUE UNIT
V
DD
Supply voltage –0.3 to 3.6 V
V
I
Input voltage DATA, LRCLK, BCLK, SCL, SDA, ADD[2:0] –0.3 to 5.5 V
Continuous total power dissipation See Dissipation Rating Table
T
A
Operating free-air temperature range –40 to 85 ° C
T
J
Operating junction temperature range –40 to 125 ° C
T
stg
Storage temperature range –65 to 125 ° C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PACKAGE T
A
≤ 25 ° C DERATING T
A
= 70 ° C T
A
= 85 ° C
POWER RATING FACTOR POWER RATING POWER RATING
RSA 2.5 W 25 mW/ ° C 1.375 W 1.0 W
(1) This data was taken using 1 oz trace copper and copper pad that is soldered directly to a JEDEC standard high-k PCB. The thermal pad
must be soldered to a thermal land on the printed-circuit board. See TI technical briefs SCBA01 D and SLUA271 for more information
about using the QFN thermal pad.
MIN MAX UNIT
V
DD
Supply voltage VDD 3 3.6 V
V
IH
High-level input voltage DATA1, DATA2, LRCLK1, LRCLK2, BCLK1, BCLK2, SCL, SDA, 2 V
ADD[2:0]
V
IL
Low-level input voltage DATA1, DATA2, LRCLK1, LRCLK2, BCLK1, BCLK2, SCL, SDA, 0.8 V
ADD[2:0]
T
A
Operating free-air temperature –40 85 ° C
3
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