Datasheet

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ABSOLUTE MAXIMUM RATINGS
DISSIPATION RATINGS
(1)
RECOMMENDED OPERATING CONDITIONS
TPA5050
SLOS492B – MAY 2006 – REVISED MAY 2007
over operating free-air temperature (unless otherwise noted)
(1)
VALUE UNIT
V
DD
Supply voltage –0.3 to 3.6 V
DATA, LRCLK, BCLK, SCL, SDA –0.3 to 5.5 V
V
I
Input voltage
ADD[2:0] –0.3 to VDD+0.3
Continuous total power dissipation See Dissipation Rating Table
T
A
Operating free-air temperature range –40 to 85 ° C
T
J
Operating junction temperature range –40 to 125 ° C
T
stg
Storage temperature range –65 to 125 ° C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 ° C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PACKAGE T
A
≤ 25 ° C DERATING T
A
= 70 ° C T
A
= 85 ° C
POWER RATING FACTOR POWER RATING POWER RATING
RSA 2.5 W 25mW/ ° C 1.375 W 1.0 W
(1) This data was taken using 1 oz trace and copper pad that is soldered directly to a JEDEC standard high-k PCB. The thermal pad must
be soldered to a thermal land on the printed-circuit board. See TI Technical Briefs SCBA017 D and SLUA271 for more information about
using the QFN thermal pad.
MIN MAX UNIT
V
DD
Supply voltage VDD 3 3.6 V
V
IH
High-level input voltage DATA, LRCLK, BCLK, SCL, SDA, ADD[2:0] 2 V
V
IL
Low-level input voltage DATA, LRCLK, BCLK, SCL, SDA, ADD[2:0] 0.8 V
T
A
Operating free-air temperature –40 85 ° C
3
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