Datasheet

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3.2 TPA4411EVM Bill of Materials

3.3 TPA4411EVM PCB Layers

Reference

Table 1. TPA4411EVM Bill of Materials

Manufacturer/

Qty. Reference Description SND Size

Part Number

TDK

2 C1, C2 Capacitor, ceramic, 1 µ F, 10 V, X7R, ± 10% 0603

C1608X7R1C105K

TDK

2 C3, C4, C5 Capacitor, ceramic, 2.2 µ F, 6.3 V, X5R, ± 20% 0603

C1608X5R0J225M

TDK

1 C6 Capacitor, ceramic, 10 µ F, 6.3 V, X5R, ± 20% 0805

C2012X5R0J106

0 C7 Not installed 0603

Panasonic

2 R1, R2 Resistor, 121 k Ω , 1/16 W, 1% 0603

ERJ-3EKF1213J

Panasonic

2 SDL, SDR Momentary switch

P8048SCT-ND

Texas Instruments

1 U1 TPA4411 audio amplifier IC 4 × 4 thin QFN package

TPA4411RTJ

Kycon, Inc., P/N

1 J1 Headphone jack

ST-3000

0 JP1 2 Position, 2 mm header (not installed)

Sullins, PTC36SABN

7 PNP Headers Terminal post headers SAMTEC

TSW-19-8-G-S

1 PCB TPA4411EVM printed-circuit board

Figure 2. Top Layer

4 TPA4411 Audio Power Amplifier Evaluation Module SLOU172A – August 2004 – Revised January 2008

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