Datasheet

TPA3125D2
SLOS611 – DECEMBER 2008 ........................................................................................................................................................................................... www.ti.com
• Grounding — The AVCC (pins 16 and 17) decoupling capacitor and BYPASS (pin 6) capacitor should each be
grounded to analog ground (AGND, pins 7 and 8). The PVCCx decoupling capacitors and VCLAMP
capacitors should each be grounded to power ground (PGND, pins 11 and 20). Analog ground and power
ground should be connected at the thermal pad, which should be used as a central ground connection or star
ground for the TPA3125D2.
• Output filter — The reconstruction filter (22 µ H and 0.68 µ F network in the output circuit) should be placed as
close to the output terminals as possible for the best EMI performance. The capacitors should be grounded to
power ground.
• Thermal pad — The thermal pad must be soldered to the PCB for proper thermal performance and optimal
reliability. The dimensions of the thermal pad and thermal land are described in the mechanical section at the
back of the data sheet. See TI Technical Briefs SLMA002 and SLOA120 for more information about using the
thermal pad. For recommended PCB footprints, see figures at the end of this data sheet.
For an example layout, see the TPA3125D2 Evaluation Module (TPA3125D2 EVM) User Manual, (SLOU250 ).
Both the EVM user manual and the thermal pad application note are available on the TI Web site at
http://www.ti.com .
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Product Folder Link(s): TPA3125D2