Datasheet

PVCC
PVCC
GAIN1
6
AVCC
7
8
AGND
9
GVDD
OUTN
BSN
BSP
OUTP
23
22
21
20
TPA3111D1
FAULT
2
GND
3
4
GND
5
GAIN0
PVCC
BSN
OUTN
PGND
27
26
25
24
PLIMIT
10
INN
11
12
INP
13
NC
PGND
OUTP
BSP
PVCC
19
18
17
16
AVCC
14
PVCC
15
GND
29
PowerPAD
SD
1
PVCC
28
PVCC
100 μF 0.1 μF
1000pF
100 Fμ
0.1 μF
1000pF
Audio
Source
Control
System
AVCC
100k Ω
10
100 kW
(1)
Ω
AVCC
1 kΩ
FB
FB
0.47 μF
1000 pF
0.47 μF
1000 pF
1 uF
1 uF
1 uF
1 uF
TPA3111D1
www.ti.com SLOS618E –AUGUST 2009–REVISED AUGUST 2012
SHORT-CIRCUIT PROTECTION AND AUTOMATIC RECOVERY FEATURE
TPA3110D2 has protection from over-current conditions caused by a short circuit on the output stage. The short
circuit protection fault is reported on the FAULT pin as a low state. The amplifier outputs are switched to a Hi-Z
state when the short circuit protection latch is engaged. The latch can be cleared by cycling the SD pin through
the low state.
If automatic recovery from the short circuit protection latch is desired, connect the FAULT pin directly to the SD
pin. This will allow the FAULT pin function to automatically drive the SD pin low which will clear the short circuit
protection latch.
THERMAL PROTECTION
Thermal protection on the TPA3111D1 prevents damage to the device when the internal die temperature
exceeds 150°C. There is a ±15°C tolerance on this trip point from device to device. Once the die temperature
exceeds the thermal set point, the device enters into the shutdown state and the outputs are disabled. This is not
a latched fault. The thermal fault is cleared once the temperature of the die is reduced by 15°C. The device
begins normal operation at this point with no external system interaction.
Thermal protection faults are NOT reported on the FAULT terminal.
APPLICATION INFORMATION
(1) 100 kΩ resistor is needed if the PVCC slew rate is more than 10 V/ms.
Figure 17. Mono Class-D Amplifier with BTL Output
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Product Folder Links: TPA3111D1