Datasheet
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ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
TPA3007D1
SLOS418D – SEPTEMBER 2003 – REVISED MARCH 2008
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
Supply voltage: V
CC,
PV
CC
– 0.3 V to 21 V
Load impedance, R
L
≥ 7 Ω
Input voltage SHUTDOWN – 0.3 V to V
CC
+ 0.3 V
GAIN0, GAIN1 – 0.3 V to 5.5 V
INN, INP – 0.3 V to 7 V
Continuous total power dissipation See Dissipation Rating Table
Operating free-air temperature range, T
A
– 40 ° C to 85 ° C
Operating junction temperature range, T
J
– 40 ° C to 150 ° C
Storage temperature range, T
stg
– 65 ° C to 150 ° C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 ° C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE T
A
≤ 25 ° C DERATING FACTOR T
A
= 70 ° C T
A
= 85 ° C
PW 1.43 W 11.45 mW/ ° C
(1)
0.915 W 0.744 W
(1) Based on High-K board
MIN MAX UNIT
Supply voltage, V
CC,
PV
CC
R
L
≥ 7.0Ω
(1)
8 18 V
Load impedance, R
L
7.0 Ω
High-level input voltage, V
IH
GAIN0, GAIN1, SHUTDOWN 2 V
Low-level input voltage, V
IL
GAIN0, GAIN1, SHUTDOWN 0.8 V
Operating free-air temperature, T
A
– 40 85 ° C
Operating junction temperature, T
J
(2)
125 ° C
(1) The TPA3007D1 must not be used with any speaker or load (including speaker with output filter) that could vary below 7.0 Ω over the
audio frequency band.
(2) Continuous operation above the recommended junction temperature may result in reduced reliability and/or lifetime of the device. The
junction temperature is controlled by the thermal design of the application and should be carefully considered in high power dissipation
applications. See the thermal considerations section on page 14 for recommendations on improving the thermal performance of your
application.
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