Datasheet
TPA3004D2
www.ti.com
SLOS407E –FEBRUARY 2003–REVISED JANUARY 2011
Pin Functions (continued)
Pin
I/O DESCRIPTION
NO. NAME
VOLUME 11 I DC voltage that sets the gain of the Class-D and VAROUT outputs.
VREF 8 I Analog reference for gain control section.
V2P5 4 O 2.5-V Reference for analog cells, as well as reference for unused audio input when using
single-ended inputs.
— Thermal — Connect to AGND and PGND—should be center point for both grounds.
Pad
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
Supply voltage range: AV
CC,
PV
CC
-0.3 V to 20 V
Load impedance, R
L
≥ 3.6 Ω
MODE, VREF, VARDIFF, VARMAX, VOLUME, FADE 0 V to 5.5 V
Input voltage range, V
I
SD -0.3 V to V
CC
+ 0.3 V
RINN, RINP, LINN, LINP -0.3 V to 7 V
AV
DD
120 mA
Supply current
AVDDREF 10 mA
Output current VAROUTL, VAROUTR 20 mA
Continuous total power dissipation See the Thermal Information Table
Operating free-air temperature range, T
A
-40°C to 85°C
Operating junction temperature range, T
J
(2)
-40°C to 150°C
Storage temperature range, T
stg
-65°C to 150°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The (TPA3004D2) incorporates an exposed PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to
a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature
that could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD
thermally enhanced package.
THERMAL INFORMATION
TPS3004D2
THERMAL METRIC
(1)(2)
UNITS
PHP (48) PIN
q
JA
Junction-to-ambient thermal resistance 26.6
q
JCtop
Junction-to-case (top) thermal resistance 12.6
q
JB
Junction-to-board thermal resistance 7.9
°C/W
y
JT
Junction-to-top characterization parameter 0.1
y
JB
Junction-to-board characterization parameter 4.2
q
JCbot
Junction-to-case (bottom) thermal resistance 0.2
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.
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