Datasheet

TPA3001D1
www.ti.com SLOS398E –DECEMBER 2002–REVISED AUGUST 2010
PRINTED-CIRCUIT BOARD (PCB) LAYOUT
Because the TPA3001D1 is a class-D amplifier that switches at a high frequency, the layout of the printed-circuit
board (PCB) should be optimized according to the following guidelines for the best possible performance.
• Decoupling capacitors—As shown in the Typical Application Circuit , the high-frequency 0.1-mF decoupling
capacitors should be placed as close to the PV
CC
(pin 9 and pin 16) and V
CC
(pin 24) terminals as possible.
The BYPASS (pin 22) capacitor, VREF (pin 23) capacitor, and VCLAMP (pin 7) capacitor should also be
placed as close to the device as possible. The large (10 mF or greater) bulk power-supply decoupling
capacitor should be placed near the TPA3001D1.
• Grounding—The V
CC
(pin 24) decoupling capacitor, VREF (pin 23) capacitor, BYPASS (pin 22) capacitor,
COSC (pin 21) capacitor, and ROSC (pin 20) resistor should each be grounded to analog ground (AGND, pin
18 and pin 19). The PV
CC
(pin 9 and pin 16) decoupling capacitors should each be grounded to power ground
(PGND, pin 12 and pin 13). Analog ground and power ground may be connected at the thermal pad, which
should be used as a central ground connection or star ground for the TPA3001D1.
• Output filter—The ferrite filter (Figure 34) should be placed as close to the output terminals (pins 10, 11, 14,
and 15) as possible for the best EMI performance. The LC filter (Figure 35 and Figure 36) should be placed
close to the ferrite filter. The capacitors used in both the ferrite and LC filters should be grounded to power
ground.
• Thermal pad—The thermal pad must be soldered to the PCB for proper thermal performance and optimal
reliability. The dimensions of the thermal pad thermal land should be 1,6 mm by 6 mm (63 mils by
236.2 mils). Two rows of solid vias (four vias per row, 0,3302 mm or 13 mils diameter) should be equally
spaced underneath the thermal land. The vias should connect to a solid copper plane, either on an internal
layer or on the bottom layer of the PCB. The vias must be solid vias, not thermal-relief or webbed vias. For
additional information, see the PowerPAD Thermally Enhanced Package application report (SLMA002).
For an example layout, see the TPA3001D1EVM 20-W Mono Class-D Audio Power Amplifier user's guide
(SLOU156).
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Product Folder Link(s): TPA3001D1