Datasheet
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ORDERING INFORMATION
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
PACKAGE DISSIPATION RATINGS
TPA2032D1
TPA2033D1
TPA2034D1
SLOS476 – JUNE 2006
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
T
A
PACKAGE PART NUMBER SYMBOL
–40 ° C to 85 ° C Wafer chip scale packaging – Lead free (YZF) TPA2032D1YZF
(1)
BPX
–40 ° C to 85 ° C Wafer chip scale packaging – Lead free (YZF) TPA2033D1YZF
(1)
BPY
–40 ° C to 85 ° C Wafer chip scale packaging – Lead free (YZF) TPA2034D1YZF
(1)
BPZ
(1) The YZF package is only available taped and reeled. To order add the suffix R to the end of the part number for a reel of 3000, or add
the suffix T to the end of the part number for a reel of 250 (e.g. TPA2032D1YZFR).
over operating free-air temperature range unless otherwise noted
(1)
TPA2032D1, TPA2033D1,
TPA2034D1
In active mode –0.3 V to 6 V
V
DD
Supply voltage
In SHUTDOWN mode –0.3 V to 7 V
V
I
Input voltage –0.3 V to V
DD
+ 0.3 V
Continuous total power dissipation See Dissipation Rating Table
T
A
Operating free-air temperature –40 ° C to 85 ° C
T
J
Operating junction temperature –40 ° C to 125 ° C
T
stg
Storage temperature –65 ° C to 150 ° C
ESD Electro-Static Discharge Tolerance - Human Body Model (HBM) for all pins
(2)
2KV
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The output pins Vo– and Vo+ are tolerant to 1.5KV HBM ESD
MIN NOM MAX UNIT
V
DD
Supply voltage 2.5 5.5 V
V
IH
High-level input voltage SHUTDOWN 1.3 V
DD
V
V
IL
Low-level input voltage SHUTDOWN 0 0.35 V
V
IC
Common mode input voltage range V
DD
= 2.5 V, 5.5 V 0.5 V
DD
–0.8 V
T
A
Operating free-air temperature –40 85 ° C
DERATING FACTOR T
A
≤ 25 ° C T
A
= 70 ° C T
A
= 85 ° C
PACKAGE
(1 / θ
JA
) POWER RATING POWER RATING POWER RATING
YZF 4.8 mW/ ° C
(1)
480 mW 264 mW 192 mW
YZF 7.5 mW/ ° C
(2)
750 mW 412 mW 300 mW
(1) Derating factor measured with JEDEC Low-K board; 1S0P - One signal layer and zero plane layers.
(2) Derating factor measured with JEDEC High K board; 1S2P - One signal layer and two plane layers.
Please see JEDEC Standard 51-3 for Low-K board, JEDEC Standard 51-7 for High-K board, and JEDEC Standard 51-12 for using
package thermal information.
Please see JEDEC document page for downloadable copies: http://www.jedec.org/download/default.cfm.
2
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