Datasheet

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375 mm
(+0, -25 mm)
275 mm
(+0, -25 mm)
Circular Solder Mask Opening
Paste Mask (Stencil)
= Copper Pad Size
75 mm
100 mm
100 mm
100 mm
100 mm
100 mm
75 mm
75 mm
EFFICIENCY AND THERMAL INFORMATION
q
JA
+
1
Derating Factor
(3)
T
A
Max + T
J
Max * q
JA
P
Dmax
(4)
TPA2032D1
TPA2033D1
TPA2034D1
SLOS476 – JUNE 2006
Figure 39. Close Up of TPA2032D1 Land Pattern From TPA2032D1 EVM
The maximum ambient temperature depends on the heat-sinking ability of the PCB system. The derating factor
for the YZF package is shown in the dissipation rating table. Converting this to θ
JA
:
Given θ
JA
(from the Package Dissipation ratings table), the maximum allowable junction temperature (from the
Absolute Maximum ratings table), and the maximum internal dissipation (from Power Dissipation vs Output
Power figures) the maximum ambient temperature can be calculated with the following equation. Note that the
units on these figures are Watts RMS. Because of crest factor (ratio of peak power to RMS power) from 9–15
dB, thermal limitations are not usually encountered.
The TPA2032D1 is designed with thermal protection that turns the device off when the junction temperature
surpasses 150 ° C to prevent damage to the IC. Note that using speakers more resistive than 4- Ω dramatically
increases the thermal performance by reducing the output current and increasing the efficiency of the amplifier.
θ
JA
is a gross approximation of the complex thermal transfer mechanisms between the device and its ambient
environment. If the θ
JA
calculation reveals a potential problem, a more accurate estimate should be made.
Please contact TI for further information.
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