Datasheet

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Component Location

Trace Width

TPA2032D1

TPA2033D1

TPA2034D1

SLOS476 – JUNE 2006

APPLICATION INFORMATION (continued)

Table 1. Land Pattern Dimensions

SOLDER PAD SOLDER MASK COPPER STENCIL STENCIL

COPPER PAD

DEFINITIONS OPENING THICKNESS OPENING THICKNESS

Nonsolder mask 275 µ m 375 µ m 1 oz max (32 µ m) 275 µ m x 275 µ m Sq. 125 µ m thick

defined (NSMD) (+0.0, –25 µ m) (+0.0, –25 µ m) (rounded corners)

NOTES:

1. Circuit traces from NSMD defined PWB lands should be 75 µ m to 100 µ m wide in the exposed area inside

the solder mask opening. Wider trace widths reduce device stand off and impact reliability.

2. Recommended solder paste is Type 3 or Type 4.

3. Best reliability results are achieved when the PWB laminate glass transition temperature is above the

operating range of the intended application.

4. For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 µ m to avoid a reduction in

thermal fatigue performance.

5. Solder mask thickness should be less than 20 µ m on top of the copper circuit pattern.

6. Best solder stencil performance is achieved using laser-cut stencils with electro polishing. Use of chemically

etched stencils results in inferior solder paste volume control.

7. Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional

component movement due to solder wetting forces.

Place all the external components very close to the TPA2032D1. Placing the decoupling capacitor, C

, close to

the TPA2032D1 is important for the efficiency of the class-D amplifier. Any resistance or inductance in the trace

between the device and the capacitor can cause a loss in efficiency.

Recommended trace width at the solder balls is 75 µ m to 100 µ m to prevent solder wicking onto wider PCB

traces. Figure 39 shows the layout of the TPA2032D1 evaluation module (EVM).

For high current pins (V

, GND V

O+

, and V

O-

) of the TPA2032D1, use 100- µ m trace widths at the solder balls

and at least 500- µ m PCB traces to ensure proper performance and output power for the device.

For input pins (IN–, IN+, and SHUTDOWN) of the TPA2032D1, use 75- µ m to 100- µ m trace widths at the solder

balls. IN– and IN+ traces need to run side-by-side to maximize common-mode noise cancellation.

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