Datasheet

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_
+
IN−
IN+
PWM H−
Bridge
V
O−
V
O+
Internal
Oscillator
C
S
To Battery
V
DD
GND
Bias
Circuitry
Single-ended
Input
TPA2032D1
Filter-Free Class D
SHUTDOWN
C
I
C
I
BOARD LAYOUT
Copper
Trace Width
Solder Mask
Thickness
Solder
Pad Width
Solder Mask
Opening
Copper Trace
Thickness
TPA2032D1
TPA2033D1
TPA2034D1
SLOS476 – JUNE 2006
APPLICATION INFORMATION (continued)
Figure 37. TPA2032D1 Application Schematic With Single-Ended Input
In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 38 and Table 1 show the appropriate diameters for a
WCSP layout. The TPA2032D1 evaluation module (EVM) layout is shown in the next section as a layout
example.
Figure 38. Land Pattern Dimensions
12
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