Datasheet

TPA2028D1

SLOS660B –JANUARY 2010–REVISED SEPTEMBER 2012

www.ti.com

Figure 45. Land Pattern Dimensions

Table 6. Land Pattern Dimensions

(1) (2) (3) (4)

SOLDER PAD SOLDER MASK

(5)

COPPER STENCIL

COPPER PAD STENCIL

(6) (7)

OPENING

DEFINITIONS OPENING THICKNESS THICKNESS

275 μm 375 μm

Non solder mask 275 μm × 275 μm Sq. (rounded

1 oz max (32 μm) 125 μm thick

defined (NSMD) corners)

(+0.0, –25 μm) (+0.0, –25 μm)

(1) Circuit traces from NSMD defined PWB lands should be 75 μm to 100 μm wide in the exposed area inside the solder mask opening.

Wider trace widths reduce device stand off and impact reliability.

(2) Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the

intended application.

(3) Recommend solder paste is Type 3 or Type 4.

(4) For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in thermal fatigue performance.

(5) Solder mask thickness should be less than 20 μm on top of the copper circuit pattern

(6) Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in

inferior solder paste volume control.

(7) Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to

solder wetting forces.

COMPONENT LOCATION

Place all the external components very close to the TPA2028D1. Placing the decoupling capacitor, C

, close to

the TPA2028D1 is important for the efficiency of the Class-D amplifier. Any resistance or inductance in the trace

between the device and the capacitor can cause a loss in efficiency.

TRACE WIDTH

Recommended trace width at the solder balls is 75 μm to 100 μm to prevent solder wicking onto wider PCB

traces. For high current pins (PVDD (L, R), PGND, and audio output pins) of the TPA2028D1, use 100-μm trace

widths at the solder balls and at least 500-μm PCB traces to ensure proper performance and output power for

the device. For the remaining signals of the TPA2028D1, use 75-μm to 100-μm trace widths at the solder balls.

The audio input pins (IN+ and IN–) must run side-by-side to maximize common-mode noise cancellation

Product Folder Links: TPA2028D1