Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLinear ICsLinear IC - Audio amplifier 2-channel (stereo) Class D QFN 20 (4x4)

RTJYZH

FEATURES DESCRIPTION

SIMPLIFIED APPLICATION DIAGRAM

APPLICATIONS

AVDD

INL–

INL+

AGND

PGND

OUTL+

OUTL–

PVDDR

10 Fm

ToBattery

SDA

INR–

INR+

C 1 F

OUTR+

OUTR–

SCL

SDZ

I CClock

I CData

MasterShutdown

TPA2016D2

Digital

Baseband

Analog

Baseband

Codec

PVDDL

TPA2016D2

www.ti.com

........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009

2.8-W/Ch Stereo Class-D Audio Amplifier with Dynamic Range Compression and AGC

• Filter-Free Class-D Architecture

The TPA2016D2 is a stereo, filter-free Class-D audio

power amplifier with volume control, dynamic range

• 1.7 W/Ch Into 8 Ω at 5 V (10% THD+N)

compression (DRC) and automatic gain control

• 750 mW/Ch Into 8 Ω at 3.6 V (10% THD+N)

(AGC). It is available in a 2.2 mm x 2.2 mm WCSP

• 2.8 W/Ch Into 4 Ω at 5 V (10% THD+N)

package and 20-pin QFN package.

• 1.5 W/Ch Into 4 Ω at 3.6 V (10% THD+N)

The DRC/AGC function in the TPA2016D2 is

• Power Supply Range: 2.5 V to 5.5 V

programmable via a digital I

C interface. The

DRC/AGC function can be configured to automatically

• Flexible Operation With/Without I

prevent distortion of the audio signal and enhance

• Programmable DRC/AGC Parameters

quiet passages that are normally not heard. The

• Digital I

C Volume Control

DRC/AGC can also be configured to protect the

• Selectable Gain from – 28 dB to 30 dB in 1-dB speaker from damage at high power levels and

compress the dynamic range of music to fit within the

Steps (when compression is used)

dynamic range of the speaker. The gain can be

• Selectable Attack, Release and Hold Times

selected from – 28 dB to +30 dB in 1-dB steps. The

• 4 Selectable Compression Ratios

TPA2016D2 is capable of driving 1.7 W/Ch at 5 V or

750 mW/Ch at 3.6 V into 8 Ω load or 2.8 W/Ch at 5 V

• Low Supply Current: 3.5 mA

or 1.5 W/Ch at 3.6 V into 4 Ω load. The device

• Low Shutdown Current: 0.2 µ A

features independent software shutdown controls for

• High PSRR: 80 dB

each channel and also provides thermal and short

• Fast Start-up Time: 5 ms

circuit protection.

• AGC Enable/Disable Function

In addition to these features, a fast start-up time and

small package size make the TPA2016D2 an ideal

• Limiter Enable/Disable Function

choice for cellular handsets, PDAs and other portable

• Short-Circuit and Thermal Protection

applications.

• Space-Saving Package

– 2,2 mm × 2,2 mm Nano-Free™ WCSP (YZH)

• Wireless or Cellular Handsets and PDAs

• Portable Navigation Devices

• Portable DVD Player

• Notebook PCs

• Portable Radio

• Portable Games

• Educational Toys

• USB Speakers

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2 Nano-Free is a trademark of Texas Instruments.

3 All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (39 pages)

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TPA2016D2 YZH RTJ www.ti.com........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009 2.8-W/Ch Stereo Class-D Audio Amplifier with Dynamic Range Compression and AGC FEATURES 1 • • • • • • • • • • 23 • • • • • • • • • • Filter-Free Class-D Architecture 1.7 W/Ch Into 8 Ω at 5 V (10% THD+N) 750 mW/Ch Into 8 Ω at 3.6 V (10% THD+N) 2.
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TPA2016D2 SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
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TPA2016D2 www.ti.com........................................................................................................................................................
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TPA2016D2 SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com AVAILABLE OPTIONS (1) TA PACKAGED DEVICES (2) PART NUMBER SYMBOL –40°C to 85°C 16-ball, 2,2 mm × 2,2 mm WCSP (+0.01 mm/ -0.
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TPA2016D2 www.ti.com........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009 OPERATING CHARACTERISTICS at TA = 25°C, VDD = 3.6V, SDZ = 1.3 V, RL = 8 Ω +33 µH, and AV = 6 dB (unless otherwise noted). PARAMETER TEST CONDITIONS kSVR VDD = 3.
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TPA2016D2 SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com I2C TIMING CHARACTERISTICS For I2C Interface Signals Over Recommended Operating Conditions (unless otherwise noted) PARAMETER fSCL Frequency, SCL tW(H) Pulse duration, SCL high tW(L) tSU(1) TEST CONDITIONS MIN No wait states TYP MAX UNIT 400 kHz 0.6 µs Pulse duration, SCL low 1.
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TPA2016D2 www.ti.com........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009 TYPICAL CHARACTERISTICS with C(DECOUPLE) = 1 µF, CI = 1 µF. SUPPLY CURRENT vs SUPPLY VOLTAGE IN SHUTDOWN 100 8 80 IDD − Supply Current − µA 10 6 4 2 0 2.5 3.5 4.
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TPA2016D2 SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com TYPICAL CHARACTERISTICS (continued) with C(DECOUPLE) = 1 µF, CI = 1 µF.
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TPA2016D2 www.ti.com........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009 TYPICAL CHARACTERISTICS (continued) with C(DECOUPLE) = 1 µF, CI = 1 µF. EFFICIENCY vs OUTPUT POWER (PER CHANNEL) EFFICIENCY vs OUTPUT POWER (PER CHANNEL) 100 100 90 80 VDD = 2.5 V 60 Efficiency − % Efficiency − % 80 VDD = 5 V VDD = 3.6 V 40 70 VDD = 3.6 V 60 VDD = 5 V VDD = 2.
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TPA2016D2 SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com TYPICAL CHARACTERISTICS (continued) with C(DECOUPLE) = 1 µF, CI = 1 µF. OUTPUT POWER vs SUPPLY VOLTAGE OUTPUT POWER vs SUPPLY VOLTAGE 2.0 4.0 fIN = 1 kHz Gain = 6 dB RL = 8 W + 33 mH WCSP 3.5 PO − Output Power − W PO − Output Power − W 2.5 1.5 THD = 10% 1.0 THD = 1% 0.5 3.
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TPA2016D2 www.ti.com........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009 APPLICATION INFORMATION AUTOMATIC GAIN CONTROL The Automatic Gain Control (AGC) feature provides continuous automatic gain adjustment to the amplifier through an internal PGA.
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TPA2016D2 SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com The AGC works by detecting the audio input envelope. The gain changes depending on the amplitude, the limiter level, the compression ratio, and the attack and release time. The gain changes constantly as the audio signal increases and/or decreases to create the compression effect.
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TPA2016D2 Gain - dB www.ti.com........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009 VIN - dBV Figure 26. Input Signal Voltage vs Gain Thus the AGC performs a mapping of the input signal vs. the output signal amplitude. This mapping can be modified according to the variables from Table 1.
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TPA2016D2 SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com Limiter Level= 630mW Limiter Level= 500mW VOUT - dBV Limiter Level = 400 mW Increasing Limiter Level Decreasing Limiter Level VIN - dBV Figure 28.
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TPA2016D2 www.ti.com........................................................................................................................................................
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TPA2016D2 SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com Small Compression Region Large Limiter Range Rotation Point @ higher gain Large Compression Region 1: 1 VOUT - dBV Rotation Point @ lower gain Small Limiter Range VIN - dBV Figure 31.
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TPA2016D2 www.ti.com........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009 1: 1 VOUT - dBV Max Gain Max Gain = 30dB = 22dB VIN - dBV Figure 33. Output Signal vs. Input Signal State Diagram Showing Different Maximum Gains A particular application requiring maximum gain of 22dB, for example. Thus, set the maximum gain at 22dB.
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TPA2016D2 SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com Input Signal Amplitue (Vrms) Gain dB Time end Attack time Time reset Release time Hold timer not used after first gain increase Hold time time Figure 34.
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TPA2016D2 www.ti.com........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009 TPA2016D2 AGC OPERATION The TPA2016D2 is controlled by the I2C interface. The correct start-up sequence is: 1. Apply the supply voltage to the AVDD and PVDD (L, R)pins. 2. Apply a voltage above VIH to the SDZ pin. The TPA2016D2 powers up the I2C interface and the control logic.
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TPA2016D2 SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com address and the read/write (R/W) bit to open communication with another device, and then waits for an acknowledge condition. The TPA2016D2 holds SDA low during the acknowledge clock period to indicate acknowledgment.
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TPA2016D2 www.ti.com........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009 MULTIPLE-BYTE WRITE AND INCREMENTAL MULTIPLE-BYTE WRITE A multiple-byte data write transfer is identical to a single-byte data write transfer except that multiple data bytes are transmitted by the master device to the TPA2016D2 as shown in Figure 38.
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TPA2016D2 SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com Register Map Table 3.
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TPA2016D2 www.ti.com........................................................................................................................................................
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TPA2016D2 SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com AGC RELEASE CONTROL (Address: 3) I2C BIT 7:6 5:0 REGISTER ADDRESS 03 (03H) – AGC Release Control REL_time LABEL Unused REL_time DEFAULT 00 001011 (1.81 sec/6 dB) DESCRIPTION AGC Release time (gain ramp down) Per Step Per 6 dB 000001 0.0137 s 0.1644 s 000010 0.0274 s 0.3288 s 000011 0.
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TPA2016D2 www.ti.com........................................................................................................................................................
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TPA2016D2 SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com AGC CONTROL (Address: 6) REGISTER ADDRESS 06 (06H) – AGC Control I2C BIT 7 6:5 4:0 LABEL DEFAULT Output Limiter Disable NoiseGate Threshold 0 (enable) Output Limiter Level 11010 (6.5dBV) 01 (4mVrms) DESCRIPTION Disables the output limiter function.
PAGE 27
TPA2016D2 www.ti.com........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009 DECOUPLING CAPACITOR ＝S) The TPA2016D2 is a high-performance Class-D audio amplifier that requires adequate power supply decoupling to ensure the efficiency is high and total harmonic distortion (THD) is low.
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TPA2016D2 SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com Figure 41. Land Pattern Dimensions Table 5. Land Pattern Dimensions (1) (1) (2) (3) (4) (5) (6) (7) SOLDER PAD DEFINITIONS COPPER PAD SOLDER MASK (5) OPENING COPPER THICKNESS Non solder mask defined (NSMD) 275 µm (+0.0, –25 µm) 375 µm (+0.
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TPA2016D2 www.ti.com........................................................................................................................................................ SLOS524D – JUNE 2008 – REVISED AUGUST 2009 EFFICIENCY AND THERMAL INFORMATION The maximum ambient temperature depends on the heat-sinking ability of the PCB system. The derating factor for the packages are shown in the dissipation rating table.
PAGE 30
TPA2016D2 SLOS524D – JUNE 2008 – REVISED AUGUST 2009........................................................................................................................................................ www.ti.com Revision History Changes from Original (June 2008) to Revision A ......................................................................................................... Page • Changed From: 1.4 W/Ch Into 8 Ω at 5 V (10% THD+N) To: 1.7 W/Ch Into 8 Ω at 5 V (10% THD+N).........................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 27-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPA2016D2RTJR QFN RTJ 20 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 TPA2016D2RTJR QFN RTJ 20 3000 330.0 12.4 4.3 4.3 1.1 8.0 12.0 Q2 TPA2016D2RTJT QFN RTJ 20 250 180.0 12.4 4.3 4.3 1.1 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 27-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPA2016D2RTJR QFN RTJ 20 3000 367.0 367.0 35.0 TPA2016D2RTJR QFN RTJ 20 3000 370.0 355.0 55.0 TPA2016D2RTJT QFN RTJ 20 250 195.0 200.0 45.0 TPA2016D2RTJT QFN RTJ 20 250 210.0 185.0 35.0 TPA2016D2YZHR DSBGA YZH 16 3000 217.0 193.0 35.0 TPA2016D2YZHR DSBGA YZH 16 3000 182.0 182.0 17.
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D: Max = 2.164 mm, Min =2.104 mm E: Max = 2.142 mm, Min =2.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.