Datasheet

Toko
1098AS-4R7M
ToshibaCRS06
SchottkyDiode
V
DD
SW
IN–
IN+
AGND
PGND
VOUT+
VOUT–
V OUT
CC
V IN
CC
22 Fm
22 Fm
1 Fm
ToBattery
Left
Channel
Input
C
IN
C
IN
V FB
CC
SDb
SDd
GAIN
4.7 Hm
GND=Bypass
V =BoostMode
DD
1 Fm
R1
50kΩ
R2
453kΩ
TPA2014D1
GPIO
EFFICIENCY AND THERMAL INFORMATION
JA
1 1
= = = 80.64 C/W
Derating Factor 0.0124
q °
(8)
A J JA Dmax
T Max = T Max P = 150 80.64 (0.193) = 134 C- q - °
(9)
BOARD LAYOUT
TPA2014D1
SLAS559A – MAY 2008 – REVISED JUNE 2008 ............................................................................................................................................................... www.ti.com
Figure 17. Bypass Circuit
The maximum ambient temperature depends on the heat-sinking ability of the PCB system. The derating factors
for the YZH and RGP packages are shown in the dissipation rating table. Apply the same principles to both
packages. Using the YZH package, and converting this to θ
JA
:
Given θ
JA
of 80.64 ° C/W, the maximum allowable junction temperature of 150 ° C, and the maximum internal
dissipation of 0.193 W (V
DD
= 3.6 V, P
O
= 1.2 W), the maximum ambient temperature is calculated with the
following equation:
Equation 9 shows that the calculated maximum ambient temperature is 134 ° C at maximum power dissipation
under the above conditions. The TPA2014D1 is designed with thermal protection that turns the device off when
the junction temperature surpasses 150 ° C to prevent damage to the IC. Also, using speakers more resistive than
8- Ω dramatically increases the thermal performance by reducing the output current and increasing the efficiency
of the amplifier.
In making the pad size for the WCSP balls, use nonsolder mask defined (NSMD) land. With this method, the
solder mask opening is made larger than the desired land area, and the opening size is defined by the copper
pad width. Figure 18 and Table 5 show the appropriate diameters for a WCSP layout.
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